1571563-1 TE Connectivity, 1571563-1 Datasheet - Page 65
![Pushbutton Switches FSM4JSMXL=TACT SWITCH,SMT,BULK](/photos/40/6/400647/pr1q89d11a_sml.jpg)
1571563-1
Manufacturer Part Number
1571563-1
Description
Pushbutton Switches FSM4JSMXL=TACT SWITCH,SMT,BULK
Manufacturer
TE Connectivity
Type
Alternate Contactr
Series
FSMJSMAr
Datasheet
1.1571563-1.pdf
(116 pages)
Specifications of 1571563-1
Pole Throw Configuration
SPST
Switch Configuration
N.O.
Actuator Style
Round Button
Actuator Material
Nylon
Current Rating (max)
0.05A
Dc Voltage Rating (max)
12VVDC
Power Rating (max)
1W
Contact Material
Copper Alloy
Product Height (mm)
5.994mm
Product Depth (mm)
5.994mm
Product Length (mm)
10.008mm
Operating Temp Range
-20C to 85C
Mounting Style
Surface Mount
Terminal Type
Gull Wing
Contact Form
SPST
Switch Function
OFF - (ON)
Illumination
Not Illuminated
Contact Rating
50 mAmps
Termination Style
Solder
Contact Plating
Silver
Actuator
Round
Housing Material
Polyamide
Operating Force
70 g
Lead Free Status / RoHS Status
Compliant
MID Technology
at Tyco Electronics
Tyco Electronics prides itself
in being the global leader in
providing Molded Interconnect
Technology (MID). In it’s most
basic form, MID technology
can be defined as any product
that results in selectively plated
plastic parts. This technology
can be used in three basic
ways, to solve 3-dimensional
electro-mechanical problems,
for shielding purposes, or to
develop antennas.
MID Technologies
Tyco Electronics can manu-
facture MID parts using three
manufacturing technologies,
Two Shot, Laser Imaging, and
Laser Direct Structuring.
Products for Mobile Equipment
MID Technology
MID
Two Shot MID Technology
Two Shot
■
■
■
■
Laser Imaging MID Technology
Laser Imaging today is typically only used for rapid prototyping
■
■
■
■
All specifications subject to change. Consult Tyco Electronics for latest specifications.
Sequential injection molded substrate
A plateable resin and a non-plateable resin
Imaging in the molding process
All electroless plating of catalyzed surfaces
Manufacturing using a circuit board production type process
Machine or single shot mold in 3–10 days
Laser image circuitry in 3–5 days
Circuitry and plating are accurate to production processes
Catalog 1654270-2
Revised 8-2007
63