QSE-028-01-H-D-DP-A Samtec Inc, QSE-028-01-H-D-DP-A Datasheet

QSE-028-01-H-D-DP-A

Manufacturer Part Number

QSE-028-01-H-D-DP-A

Description

Conn Differential Pair SKT 56 POS 0.8mm Solder ST SMD

Manufacturer

Samtec Inc

Type

Differential Pairr

Series

QStrip® QSEr

Datasheet

1.QSE-028-01-H-D-DP-A.pdf (1 pages)

Specifications of QSE-028-01-H-D-DP-A

Pitch

0.8 mm

Number Of Rows

Number Of Contacts

Gender

SKT

Contact Plating

Gold Over Nickel

Termination Method

Solder

Connector Type

Differential Pair Array, Female

Number Of Positions

Mounting Type

Surface Mount

Features

Board Guide, Ground Bus (Plane), Shielded

Contact Finish

Gold

Contact Finish Thickness

30µin (0.76µm)

Mated Stacking Heights

5mm

Height Above Board

0.128" (3.25mm)

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QSE-028-01-H-D-DP-A

Manufacturer:

Samtec Inc.

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QSE-028-01-H-D-DP-A-GP

Manufacturer:

Samtec Inc.

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QSE-028-01-H-D-DP-A-K

Manufacturer:

Samtec Inc.

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QSE-028-01-H-D-DP-A-K-TR

Manufacturer:

Samtec Inc.

Quantity:

12 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

QSE-028-01-H-D-DP-A-L

Manufacturer:

Samtec Inc.

Quantity:

12 000

Current page: 1 of 1
Download datasheet (702Kb)

For complete speciﬁ cations and

recommended PCB layouts see

www.samtec.com?QSE-DP

Insulator Material:

Liquid Crystal Polymer

Contact Material:

Phosphor Bronze

Plating:

Au over 50µ" (1,27µm) Ni

Current Rating:

Contacts: 2A @ 80°C

Ground Plane: 9.5A @ 80°C

Operating Temp Range:

-55°C to +125°C

Voltage Rating:

225 VAC (5mm Stack Height)

Max Cycles:

100

Unmating Force (-RT1 option):

-RT1 option increases

unmating force up to 50%

RoHS Compliant:

Yes

Processing:

Max Processing Temp:

230°C for 60 seconds, or

260°C for 20 seconds 3x

Lead–Free Solderable:

Yes

SMT Lead Coplanarity:

(0,10mm) .004" max (014-042)

(0,15mm) .006" max (056)

Board Stacking:

For applications requiring

more than two connectors

per board or 56 pairs or higher,

contact ipg@samtec.com

*Note: –C Plating passes

10 year MFG testing

Note: Some lengths, styles

and options are non-standard,

non-returnable.

0,80

F-208-1

SPECIFIC OPTION

• 8mm, 11mm, 14mm,

• 30µ" (0,76µm) Gold

• Guide Posts & Edge Mount

• 70 Pairs

• “Partitionable”-combine

Call Samtec.

SPECIFICATIONS

15mm, 16mm, 19mm,

22mm, 25mm and 30mm

stack height (Caution:

Some automatic placement/

inspection machines may

have component height

restrictions. Please consult

machinery speciﬁ cations.)

(Specify -H plating for Data

Rate cable mating

applications.)

differential & single-ended

banks in same connector

APPLICATION

Mates with:

QTE-DP, EQDP

(See Application

Speciﬁ c note)

DIFFERENTIAL PAIR

(7,24)

QSE

.285

(3,05)

.120

LEAD STYLE

Processing conditions will affect

mated height.

STACK HEIGHT

QTE-DP

–01

–014, –028,

(14 pairs per bank)

–042, –056

(20,00) .7875

x (20,00) .7875 + (1,27) .050

HEIGHT WITH

(0,80)

.0315

(5,00) .198

QTE-DP

(No. of Pairs/14)

NO. OF

PAIRS

WWW.SAMTEC.COM

Blade &

Beam Design

QSE–014–01–F–D–DP–A

QSE–042–01–L–D–DP–A

ALSO AVAILABLE

(2,40)

.0945

Board Spacing Standoffs.

= Gold Flash on Signal Pins and Ground Plane, Matte Tin on

See SO Series.

(0,15)

Au over 50µ" (1,27µm) Ni on Ground Plane in contact area,

.006

= 10µ" (0,25µm) Gold on Signal Pins and Ground Plane,

Matte Tin over 50µ" (1,27µm) min Ni on all solder tails

Ni on Signal Pins in contact area, 10µ" (0,25µm) min

(0,80mm)

.0315"

pitch

50µ" (1,27µm) min Au over 150µ" (3,81µm)

(3,25)

(7,49)

.128

.295

PLATING

OPTION

= Electro-Polished Selective

(3,81)

.150

Matte Tin on tails

(0,89)

.035

DIA

–RT1

5mm Stack Height

Performance data for other stack heights

available at www.samtec.com?QSE-DP

Differential Pair Signaling

–01

–C*

–L

–F

tails

Integral metal plane for

power or ground

(0,76)

.030

(3,76)

.148

DIA

QSE–028–01–F–D–DP–A–RT1

Rated @ -3dB Insertion Loss

QSE-DP

SERIES

8.5 GHz / 17 Gbps

OPTION

= Retention

= (8,25mm)

OTHER

Packaging

maximum)

Polyimide

Place Pad

.325" DIA

positions

–RT1

–TR

& Reel

Option

Pick &

= Tape

(–042

–K

ﬁ lm

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