IVM06A300X200X0.4 TDK Corporation, IVM06A300X200X0.4 Datasheet - Page 2

• Manufacturer Part Number: IVM06A300X200X0.4
• Description: EMI/RFI Suppressors & Ferrites 300 X 200 X 0.4 mm
• Manufacturer: TDK Corporation

Specifications of IVM06A300X200X0.4

• Dimensions: 200 mm W x 300 mm L x 0.4 mm H
• Shielding: Shielded
• Product: Absorber Sheets & Tiles
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Material lineup
Representative example
of applications
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Method of naming the products
IRL02
Standard material characteristics/specifications
Material name
Recommended frequency
Operating temperature range ( C)
Initial permeability
Resistivity (
Standard sheet shape (mm)
Standard sheet thickness (mm)
Standard sheet weight (g)
Density (g/cm
Fire-resistant standard
Environmentally friendly
**
Material name
Recommended frequency
Operating temperature range ( C)
Initial permeability
Resistivity (
Standard sheet shape (mm)
Standard sheet thickness (mm)
Standard sheet weight (g)
Density (g/cm
Fire-resistant standard
Environmentally friendly
Type ( Feature/Use )
Thermal conductivity (W/mK)
Type ( Feature/Use )
Thermal conductivity (W/mK)
Laptop PCs / PDA devices / game consoles
Cellular phones / PHS phones
Digital video cameras / Digital still cameras
CD drive / DVD players
Liquid crystal displays
Facsimiles / Copying machines / Printers
High-speed interface devices
Car navigational systems
Optical communication devices
Optical transmission modules
Measuring equipment
Experimental apparatuses / ISM devices
ATM (asynchronous transfer mode) exchange
Cellular phone
PHS base stations
ITS-related units, devices
UL94 standard acquisition product is also prepared.
Material name
Form sign
/
/
Upper surface layer sign*
3
3
)
)
)
)
Adhesion processing sign*
H 200
(Rectangle type: No publication)
L
In the case of half-cut
products, a unit simple
substance size is indicated.
i
i
Half-cut sign*
[at 10MHz]
[at 10MHz]
x
W
*
Unsettled product : No publication
x
x
T (mm)
200
x
1
Standard/wide band
IRL02
Heat-resistance
IRJ01
100MHz to 10GHz
-
20 min.
1M min.
1.4
200
1.0
100
3.2
RoHS* & halogen-free
100MHz to 10GHz
-
18 min.
1M min.
1.0
250
0.5
85
2.5
Acquired UL94V-0
RoHS* & halogen-free
40 to + 125
40 to + 85
Reduction of inductive coupling between
high-speed bus lines and facing circuits
x
x
2.0
200
200
250
coupling from inter-unit flat cables
Reduction of inductive coupling between
from high-speed CPU, LSI, and IC
high-speed bus lines and facing circuits
Reduction of electromagnetic interference, resonance,
Digital Camera
high-speed interface control circuits
Reduction of radiation and
Reduction of radiation from LCD signal cables
coupling from inter-unit flat cables
300
0.05
10
2.5
Reduction of radiation
LCD shields (prevention of secondary radiation)
Reduction of radiation from LCD signal cables
Reduction of radiation from
Reduction of radiation from
high-speed CPU, LSI, and IC
Reduction of radiation and
high-speed interface control circuits
Reduction of inductive coupling between
Reduction of induced electric currents on
x
and standing waves inside shield chassis
TDK CORPORATION
from LCD signal cables
high-speed bus lines and facing circuits
Reduction of radiation
200
0.1
20
high-speed interface control circuits
High insulation/ burn resistant
IVM05
100MHz to 3GHz
-
7 min.
1G min.
1.2
300
0.4
80
3.3
Acquired UL94V-0
RoHS* & halogen-free
coupling from inter-unit flat cables
Reduction of radiation from
40 to + 85
Reduction of radiation from
Reduction of radiation from
high-speed CPU, LSI, and IC
Reduction of radiation and
x
200
IRL03
100MHz to 10GHz
-
20 min.
1M min.
1.4
300
0.25
50
3.4
RoHS*
40 to + 85
DVC
IRL, IRJ, IVM,
IRB, IRE
x
200
0.5
100
1.3
IVM06
100MHz to 3GHz
-
12 min.
1G min.
300
0.4
80
3.3
Acquired UL94V-0
RoHS*
40 to + 85
1
x
200
BACK
Reduction of electromagnetic interference, resonance,
High performance/wide band
IRL04
50MHz to 10GHz
-
30 min.
10k min.
1.4
300
0.25
50
3.3
**
RoHS* & halogen-free
40 to + 85
materials
LCD shields (prevention of secondary radiation)
x
Reduction of radiation from LCD signal cables
NEXT
200
0.5
100
Reduction of inductive coupling between
Reduction of inductive coupling between
Reduction of induced electric currents on
and standing waves inside shield chassis
high-speed bus lines and facing circuits
high-speed bus lines and facing circuits
For Semi-micro waveband For GHz wavebands
IRB02
500MHz to 5GHz
-
6 min.
1M min.
1.2
300
1.0
300
3.3
RoHS* & halogen-free
40 to + 70
high-speed interface control circuits
coupling from inter-unit flat cables
coupling from inter-unit flat cables
1.0
200
x
Reduction of human head SAR
3
Laptop PC
2.0
600
300
Reduction of radiation from
Reduction of radiation from
high-speed CPU, LSI, and IC
Reduction of radiation and
Reduction of radiation and
(Specific Absorption Rate)
Cellular Phone / PHS
*
This means that, in conformity with EU
Directive 2002/95/EC, lead, cadmium,
mercury, hexavalent chromium, and
specific bromine-based flame retardants,
PBB and PBDE, have not been used,
except for exempted applications.
3.0
900
IRL, IRJ, IVM, IRB, IRE
Conformity to RoHS Directive:
6.0
1800
RL05
10MHz to 10GHz
-
50 min.
1G min.
1.5
300
0.11
25
3.7
RoHS* & halogen-free
40 to + 85
PDA
x
( Magnetic layer : 0.1)
200
IRE02
3 to 30GHz
-
4 min.
1M min.
0.8
300
1.0
250
3.75
RoHS* & halogen-free
40 to + 70
( Magnetic layer :10 typ. )
x
2.0
500
300
3.0
750
2