CM1400-03CP-HST ON Semiconductor, CM1400-03CP-HST Datasheet - Page 9

• Manufacturer Part Number: CM1400-03CP-HST
• Description: EMI/RFI Suppressors & Ferrites 6-Ch EMI Filter with ESD Protection
• Manufacturer: ON Semiconductor

Specifications of CM1400-03CP-HST

• Product: EMI Filters
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
© 2008 California Micro Devices Corp. All rights reserved.
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Non-Solder Mask Defined Pad
250
200
150
100
50
Solder Stencil Opening
Figure 11. Lead-free (SnAgCu) Solder
Solder Mask Opening
0
0.275mm DIA.
0.330mm DIA.
0.325mm DIA.
1:00.0
Ball Reflow Profile
●
Issue B – 06/03/08
Tel: [phone]
Time (minutes)
2:00.0
3:00.0
●
Fax: [phone]
4:00.0
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125mm - 0.150mm
0.325mm Round
0.330mm Round
50/50 by volume
●
60 seconds
0.275mm
No Clean
CM1400-03
www.cmd.com
VALUE
+50μm
+20μm
Round
260°C
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