MMUN2238LT1G ON Semiconductor, MMUN2238LT1G Datasheet

TRANS BRT NPN 50V SOT-23

MMUN2238LT1G

Manufacturer Part Number
MMUN2238LT1G
Description
TRANS BRT NPN 50V SOT-23
Manufacturer
ON Semiconductor
Datasheet

Specifications of MMUN2238LT1G

Transistor Type
NPN - Pre-Biased
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
50V
Resistor - Base (r1) (ohms)
2.2K
Dc Current Gain (hfe) (min) @ Ic, Vce
160 @ 5mA, 10V
Vce Saturation (max) @ Ib, Ic
250mV @ 1mA, 10mA
Current - Collector Cutoff (max)
500nA
Power - Max
246mW
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
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Manufacturer:
ON Semiconductor
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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION
14 Oct 2008
SUBJECT: ON Semiconductor Final Product/Process Change Notification # 16165
TITLE: Final Notification for Gold wire changing to Copper wire on SOT-23 BRT parts
PROPOSED FIRST SHIP DATE: 14 Jan 2009
AFFECTED CHANGE CATEGORY: ON Semiconductor assembly – wire bond
AFFECTED PRODUCT DIVISION: Discrete Products
FOR SAMPLES: Contact your local ON Semiconductor Sales Office
FOR ANY QUESTIONS CONCERNING RELIABILITY DATA:
Contact your local ON Semiconductor Sales Office or Laura Rivers <laura.rivers@onsemi.com>
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or Calvin Lim<calvin.lim@onsemi.com>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers. FPCNs are issued at least 90 days prior to implementation
of the change.
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact your local ON
Semiconductor Sales Office.
DESCRIPTION AND PURPOSE:
This is the FPCN to IPCN 16009 available at www.onsemi.com. On Semiconductor is
notifying customers of its plan to convert to Copper wire on Bias Resistor Transistor (BRT)
products in the SOT-23 package.
The mold compound, die attach, and lead frame materials used in the SOT-23 package will
remain the same. Two qualification vehicles, a transistor and a diode, have been selected for
each of the device functions and full electrical characterization of the BRTs over temperature
has be performed on each BRT vehicle to ensure device functionality and electrical
specifications are met.
Devices listed in this final PCN will be converted to Copper wire starting WW0109. After
January 01, 2009, customer may receive devices with either Gold or Copper as conversion is
implemented in our assembly facility. Conversion of specific devices will take place at the
beginning of the specified month and devices containing Copper wire can be identified by the
date code (1 or greater).
Issue Date: 14 Oct 2008
Rev.14 Jun 2007
Page 1 of 3

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MMUN2238LT1G Summary of contents

Page 1

... To do so, contact your local ON Semiconductor Sales Office. DESCRIPTION AND PURPOSE: This is the FPCN to IPCN 16009 available at www.onsemi.com. On Semiconductor is notifying customers of its plan to convert to Copper wire on Bias Resistor Transistor (BRT) products in the SOT-23 package. The mold compound, die attach, and lead frame materials used in the SOT-23 package will remain the same ...

Page 2

Final Product/Process Change Notification # 16165 QUALIFICATION PLAN: Reliability testing was performed on qualification vehicles chosen based on die size, voltage rating, and run rates. RELIABILITY RESULTS: BCX19LT1G: MSL Preconditioning JEDEC MSL 1 @ 260C HTSL Ta = 150C, 1008 ...

Page 3

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