5536642-1 TE Connectivity, 5536642-1 Datasheet - Page 22

• Manufacturer Part Number: 5536642-1
• Description: Conn Backplane HDR 10Power POS 2mm Press Fit ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner
• Series: Z-PACKr

Specifications of 5536642-1

• Pitch: 2 mm
• Number Of Rows: 5
• Number Of Contacts: 10Power
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel|Gold Over Palladium Nickel Over Nickel
• Connector Type: Backplane
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 10
• Gender: Header
• Contact Termination: Press Fit
• No. Of Rows: 5
• Rohs Compliant: Yes
• Pitch (mm): 2mm
• Body Orientation: Straight
• Number Of Contact Rows: 5
• Mounting Style: Through Hole
• Voltage Rating Max: 30VAC
• Current Rating (max): 5/ContactA
• Contact Material: Copper Alloy
• Housing Color: Natural
• Housing Material: Liquid Cryst Polymer
• Product Height (mm): 17mm
• Product Depth (mm): 17.8mm
• Product Length (mm): 11.88mm
• Number Of Positions / Contacts: 10
• Product Type: Connectors
• Voltage Rating: 300 V
• Pcb Mounting Orientation: Vertical
• Post Type: Press-Fit
• Make First / Break Last: No
• Module Type: Power
• Number Of Power Positions: 10
• Pin Header Width (mm [in]): 18.00 [0.709]
• Voltage Rating (vac): 30
• Sequencing: Yes
• Sequencing Configuration Row A: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row B: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row C: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row D: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Sequencing Configuration Row E: Mating Post Length 6.5mm, Termination Post Length 4.25mm
• Post Plating: Tin
• Centerline, Matrix (mm [in]): 2.00 x 2.00 [.079 x .079]
• Contact Type: Pin
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: Gold or Gold Flash over Palladium Nickel
• Connector Style: Plug
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Application: Fixed-Board
• Lead Free Status / Rohs Status: Compliant

Catalog 1773096
Revised 2-10
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Power Connectors & Interconnection Systems
MINIPAK High-Density Board-to-Board Power Connectors
MINIPAK High-Density Power Connectors
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MINIPAK HDL Connectors
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MINIPAK HD Connectors
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MINIPAK HDE Connectors
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32 Amps per contact, fully loaded
Features an innovative Dual Blade contact that allows splitting
4.5 mm pitch contacts into multiple voltage rails
Various alignment guides, signal contacts, and power contacts
available to use on 4.5 mm, 6.0 mm, and 7.5 mm pitches
High density blind-mateable connector
Low profile-stands just 8.0 mm off the PCB
Solder and press-fit tails available
Current rating of 16A
Low contact resistance with mating forces less than 0.3lbs per
contact
Designed to the PICMG MicroTCA.0 Standard
Combines 24 power contacts and 72 high density signal
contacts
Rugged contact design helps provide long-term reliability
Hot-plug design controls arc during hot mate/unmate cycles
3 mating levels
Very high current density
Two row configuration saves PCB space
Two levels of contact sequencing available for mate-first-
break-last operation
Uses a hot-plug contact approved by UL for current interrupt
applications
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-(0)8002-67666
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