646445-1 TE Connectivity, 646445-1 Datasheet - Page 4

• Manufacturer Part Number: 646445-1
• Description: Conn Hard Metric RCP 200 POS 2mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Hard Metricr
• Series: Z-PACKr

Specifications of 646445-1

• Pitch: 2 mm
• Number Of Rows: 8
• Number Of Contacts: 200
• Termination Method: Solder
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2mm
• Gender: RCP
• Body Orientation: Right Angle
• Number Of Contact Rows: 8
• Mounting Style: Through Hole
• Contact Material: Phosphor Bronze
• Housing Color: Gray
• Housing Material: Polyester
• Product Height (mm): 17.4mm
• Product Depth (mm): 22.4mm
• Product Length (mm): 49.9mm
• Connector Type: Hard Metric (HM)
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 200
• Contact Termination: Right Angle Press Fit
• No. Of Rows: 8
• Rohs Compliant: Yes
• Product Type: Female
• Number Of Positions / Contacts: 200
• Termination Style: Press Fit
• Pcb Mounting Orientation: Right Angle
• Board Mount: Free Board
• Module Length (mm [in]): 48.00 [1.891]
• Crosstalk Version: Standard
• Amp Standard Option Number: 1
• Shielded: No
• Interface Type: 2mm HM
• Termination End Plating: Tin-Lead over Nickel
• Number Of Positions: 200
• Grounding Contact: Without
• Rows Loaded: A, B, E, F, D, C, G, H
• Contact Configuration: ACTION PIN Post, Signal
• Feedthrough Post Length (mm [in]): 3.30 [0.130]
• Compactpci: Yes
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Connector Style: Receptacle
• Mating Alignment: With
• Mating Alignment Type: Multi-Purpose Center
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

4
Dimensions Between Boards
Daughtercard to backplane dimension
12.5 [.492] except for reverse sex which
is 17.7 [.700]. Stacked daughtercard
spacing is 15.0 [.591].
Minimum spacing between
daughtercards is 16.0 [.630] (18.0 [.709]
for cable connectors; 20.0 [.787] for
EMI/RFI shield systems; 24.0 [.945] for
8 and 8+2 row systems).
Card extender spacing 15.0 [.591].
See Application Specification 114-19029
for details and tolerances.
Catalog 65911
Revised 7-05
www.tycoelectronics.com
Card Extenders
Pages 24, 25
Cable Headers
Pages 63, 64
Parallel Card Connection
Pages 10 and 26
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
AMP Z-PACK 2mm HM Hard Metric
Interconnection System
System Options — Front
8 and 8+2 Row
Pages 16-24
Reverse Sex
Connection
Pages 25-27
reference purposes only.
Dimensions are shown for
Specifications subject
to change.
Power, Coax and
Fiber Optic Systems
Pages 34-46
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Universal Power
Module and
Guide Pins
Pages 51-57
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
5 and
5+2 Row
Pages 10-15