106012-1 TE Connectivity, 106012-1 Datasheet - Page 6

• Manufacturer Part Number: 106012-1
• Description: Conn Hard Metric PL 55 POS 2mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Hard Metricr
• Series: Z-PACKr

Specifications of 106012-1

• Pitch: 2 mm
• Number Of Rows: 5
• Number Of Contacts: 55
• Termination Method: Solder
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel
• Pitch (mm): 2mm
• Gender: PL
• Body Orientation: Right Angle
• Number Of Contact Rows: 5
• Mounting Style: Through Hole
• Contact Material: Phosphor Bronze
• Housing Color: Gray
• Housing Material: Polyester
• Product Depth (mm): 26.8mm
• Product Length (mm): 24.95mm
• Connector Type: Hard Metric (HM)
• Row Pitch: 2mm
• Pitch Spacing: 2mm
• No. Of Contacts: 55
• Contact Termination: Right Angle Press Fit
• No. Of Rows: 5
• Rohs Compliant: Yes
• Product Type: Male
• Number Of Positions / Contacts: 55
• Mounting Angle: Right
• Termination Style: Press Fit
• Pcb Mounting Orientation: Right Angle
• Board Mount: Free Board
• Module Length (mm [in]): 25.00 [0.984]
• Crosstalk Version: Standard
• Front Mating Level: Level 1
• Shielded: No
• Interface Type: 2mm HM
• Termination End Plating: Tin-Lead over Nickel
• Number Of Positions: 55
• Grounding Contact: Without
• Contact Configuration: ACTION PIN Post, Signal
• Feedthrough Post Length (mm [in]): 3.70 [0.145]
• Compactpci: No
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Style: Short Tail
• Contact Base Material: Phosphor Bronze
• Connector Style: Plug
• Mating Alignment: Without
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Compliant

6
Product Characteristics
Electronic developments are
increasing the demands on
system performance, and
connectors can no longer
be considered as discrete
components but as part of a
total electrical/electronic
design. These aspects can
include the following:
Higher pin count within tight
space constraints.
With 25 and 40 signal pins
per cm of 5 row and 8 row
connectors respectively, high
densities can be achieved,
or low signal to ground
ratios specified within tight
space constraints.
Minimum reflections
Matched impedance
between cables, connectors
and systems give low reflec-
tions at interfaces. This is
achieved with overmolded
receptacle contacts which
give impedances close to
the values of printed circuit
boards, maximizing effec-
tive signal strength.
Reduced crosstalk
Crosstalk can be minimized
by selective use of ground
pins between signals,
which can be augmented
by the use of ground return
shields. Reduced cross talk
versions of the receptacle
connector provide partial
shielding between columns.
Catalog 65911
Revised 7-05
www.tycoelectronics.com
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
AMP Z-PACK 2mm HM Hard Metric
Interconnection System
Product Characteristics and System Features
Shielding
Upper and/or lower ground
return shields are used with
5+2 and 8+2 row headers
to improve signal integrity.
EMI / RFI shields are avail-
able to totally enclose 5 row
connectors to give maxi-
mum immunity from, and
minimum emission of, radi-
ated noise.
Reduced Skew
The design of right angle
connectors achieves very
low skew between longest
and shortest contact and
board paths, corrected for
board effects. The actual
value varies between 5 row
and 8 row types.
Fiber Optic Connections
As well as the normal
power and coaxial DIN con-
tacts, either DIN fiber optic
or AMP MSC fiber optic
connectors can be included
in backplane systems for
high speed data transfer
without risk of corruption.
Upgradeability
The system is upgradeable
to give enhanced perform-
ance as system demands
increase. This allows eco-
nomical selection of compo-
nents initially with enhanced
version selectable as per-
formance levels increase
without a major change in
connector design or board
layout. Tyco Electronics rec-
ommends that board layouts
include ground return shield
holes for future-proofing.
reference purposes only.
Dimensions are shown for
Specifications subject
to change.
System Features
Termination
All versions use
AMP ACTION PIN press fit
contacts, giving high reten-
tion force termination con-
forming to IEC 352-5.
Pin Headers
Contact pins are available
to give three mating levels
on the front face with stan-
dard 3.7 [.146] tail, suitable
for boards from 1.4 to 4.3
[.055 - .169] thick.
Feedthrough vertical head-
ers offer three levels of mat-
ing to rear of backplane for
midplane and cable con-
nection with special twisted
pins used for cross connect
applications. A wide variety
of standard product exists
which offer economy and
short lead times, but any
variation of selective load
can be offered.
Receptacle Assemblies
Receptacle assemblies
employ a 'chiclet' assembly
principle allowing a variety
of selective loading and
providing the ability to fit
reduced cross talk shields.
Enhanced versions are pre-
fitted with upper shields,
with lower shields applied
separately as required.
Power Connection
Universal Power Module
Connectors are press fit
three position connectors
with the option of three
levels of sequencing and
23A rating.
Alternatively, DIN contacts
can be used in type L ,M
and N housings with con-
tact rating up to 40A and
first make/last break option.
Variations of cable-to-
board, board-to-board and
cable-to-cable are offered.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Coaxial Connection
DIN coax contacts can be
fitted to type L, M and N
housings in cable and
board mount versions.
Fiber Optic Connections
DIN style contacts can
be fitted to housings as
above or higher density
AMP MSC contacts to MSC
housings.
Spice Models
To achieve optimum
performance and cost,
it is essential to accurately
match connector and
system parameters. Where
customers wish to carry
out their own analysis,
Tyco Electronics offers sin-
gle and multi-line models
for many connector styles.
Please ask for details of the
packages available.
Modelling Support
Tyco Electronics offers a
structured approach to the
design and evaluation of
packaging and intercon-
nection systems, including
a full range of electrical
and mechanical support
functions.
Using accurate device
models, our capabilities
include high speed signal
propagation analysis using
SPICE modelling, and simu-
lation of interconnections
and backplane designs.
Complete power distribution
and thermal analysis can
also be included.
System Manufacture
Tyco Electronics Circuits
and Packaging Division
specializes in the design
and manufacture of high
performance backplanes
and subsidiary boards.
They will design back-
planes and boards to meet
your performance criteria,
bringing their experience
and tools to enhance your
design. Ask Tyco Electronics
for further details.
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967