536255-5 TE Connectivity, 536255-5 Datasheet - Page 2

• Manufacturer Part Number: 536255-5
• Description: Conn Backplane F 120 POS 1.27mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Backplaner

Specifications of 536255-5

• Pitch: 1.27 mm
• Number Of Contacts: 120
• Termination Method: Solder
• Mounting: Through Hole
• Contact Plating: Gold
• Product Type: Receptacles
• Number Of Rows: 2
• Number Of Positions / Contacts: 4
• Mounting Angle: Vertical
• Mounting Style: Through Hole
• Termination Style: Solder
• Housing Material: Thermoplastic
• Contact Material: Phosphor Bronze
• Mount Angle: Vertical
• Termination Method To Pc Board: Through Hole - Solder
• Pcb Mount Retention: Without
• Guides: Without
• Flame Retardant: Yes
• Bus Bar Material: Phosphor Bronze
• Tail Length (mm [in]): 4.5 [0.177]
• Bus Bar Mating Area Plating: Gold (30)
• Bus Bar Termination Area Plating: Tin-Lead with Nickel underplated
• Number Of Positions: 120
• Signal Contact Material: Phosphor Bronze
• Signal Contact Mating Area Plating: Gold (30)
• Signal Contact Termination Area Plating: Tin-Lead with Nickel underplated
• Connector Style: Receptacle
• Stack Height (mm [in]): 10.92 [0.430], 18.75 [0.738]
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Lead Free Status / Rohs Status: Details

I
I
I
I
I
I
I
I
I
I
I
I
I
R
R
Tyco Electronics Micro-Strip
connectors are a high
density, controlled
impedance connector
family compatible with the
requirements of high den-
sity and high speed data
transmission technologies.
Each signal line within the
mated connector is located
at a specific distance from
an integral, separable bus
bar serving as a ground
plane in a micro-strip
configuration. The selection
of housing dielectric,
spacing from signal
contact-to-ground plane
and conductor geometry
provide a specific charac-
teristic impedance plus
very low inductance and
capacitance.
Discontinuities resulting
from connector structure
and solder interfaces are
dimensionally small and
therefore appear transpar-
ent to high speed signals.
Both vertical and right-
angle board-to-board and
cable-to-board connector
versions share a nominal
impedance of 50 ohms
(single ended) or 100 ohms
(differential pair).
Each one inch length of
connector houses two elec-
trically isolated high current
contacts. When soldered to
the PC board ground plane,
that ground plane is
extended through the
mated connector.
Resistance is minimized
by a large contact area and
short electrical length, pro-
viding signal return paths
with negligible ground loop
voltages. Since signal
return is via the bus bars,
signal-ground-signal
alternation, common to
high speed applications,
becomes unnecessary. All
contacts can be dedicated
to signal transmission,
effectively doubling
connector density.