645169-3 TE Connectivity, 645169-3 Datasheet - Page 127

• Manufacturer Part Number: 645169-3
• Description: Conn Card Edge SKT 104 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Card Edger

Specifications of 645169-3

• Number Of Contacts: 104
• Contact Plating: Nickel
• Mounting: Through Hole
• Termination Method: Solder
• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contact Rows: 2
• Body Orientation: Straight
• Contact Material: Phosphor Bronze
• Mounting Style: Through Hole
• Product Height (mm): 15.49mm
• Operating Temp Range: -55C to 85C
• Pitch (mm): 2.54mm
• Housing Material: Polyester
• Housing Color: Black
• Current Rating (max): 3/ContactA
• Voltage Rating Max: 1000VAC
• Contact Resistance Max: 10
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Rohs Compliant: No
• Product Type: Connector
• Product Series: Standard Edge II
• Type Of Connector: Special 18/31 Dual Combination
• Number Of Dual Positions: 52
• Post Type: Solder Post
• Pcb Mounting Orientation: Vertical
• Mounting Ears: Without
• Pcb Mount Retention: Without
• High Current: No
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin
• Centerline (mm [in]): 2.54 [0.100]
• Retention Latch: Without
• Positions Unloaded: None
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Underplate Material: Nickel
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Lead Free Status / RoHS Status: Not Compliant

Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Product Facts
High density .050" [1.27]
center spacing.
Staggered contacts for low
insertion force.
Designed for multi-layer
.093" [2.36] daughter cards.
High temperature SMT sol-
der reflow temperatures of
260° for 30 seconds.
Unique pin geometry allows
for even distribution of
forces reducing axial pin
rotation and preserving per-
pendicularity to the
PCB board.
Edge and side coining pro-
vides a uniform pin radius
ensuring maximum contact
without "skiving"
the plated hole.
Full complement of applica-
tion tooling available.
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E60980
Certified by Canadian
Standards
Association,
File No. LR 49571
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
®
High Density (.050" [1.27]
center spacing) Press-Fit
connectors from Tyco
Electronics are designed for
high density backplane or
mid-plane applications.
Compliant pin connectors
from Tyco Electronics meet
or exceed requirements of
current industry standards,
including Bellcore specifica-
tions, which address critical
performance issues such as
hole retention, hole deforma-
tion and environmental per-
f o r m a n c e .
Card Edge Connectors
(Press-Fit Board-To-Board)
High Density Press-Fit Card Edge
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Electrical Characteristics:
Operating Voltage–600VDC (sea
level)
Current Rating –1.5 Amperes
Initial Contact Resistance –
30 milliohms
Environmental
Characteristics:
Operating Temperature –
-55˚C to +125˚C
Temperature Cycling –
MIL-STD-202 method 107
Vibration–
MIL-STD-202, method 204
USA: 1-800-522-6752
Canada: 1-905-470-4425
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UK: 44-141-810-8967
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