BTA08-700CRG STMicroelectronics, BTA08-700CRG Datasheet - Page 5

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BTA08-700CRG

Manufacturer Part Number
BTA08-700CRG
Description
TRIAC 8A 700V INSUL TO220AB
Manufacturer
STMicroelectronics
Datasheet

Specifications of BTA08-700CRG

Triac Type
Standard
Mounting Type
Through Hole
Configuration
Single
Current - Hold (ih) (max)
25mA
Voltage - Off State
700V
Current - Gate Trigger (igt) (max)
25mA
Current - Non Rep. Surge 50, 60hz (itsm)
80A, 84A
Current - On State (it (rms)) (max)
8A
Voltage - Gate Trigger (vgt) (max)
1.3V
Package / Case
TO-220-3
Current - On State (it (rms) (max)
8A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-4156-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BTA08-700CRG
Manufacturer:
STMicroelectronics
Quantity:
135
Part Number:
BTA08-700CRG
Manufacturer:
ST
0
BTA08, BTB08 and T8 Series
Figure 7.
Figure 9.
Figure 11. Relative variation of critical rate of
6
5
4
3
2
0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1000
1
100
0
(dI/dt)c [T ] /
10
0.1
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
0.01
I
TSM
TW
pulse with width t < 10 ms and corresponding value of I t
(A), I t (A s)
dI/dt limitation:
j
25
50A/µs
(dI/dt)c [T s
Non-repetitive surge peak on-state
current for a sinusoidal
Relative variation of critical rate of
decrease of main current versus
(dV/dt)c (typical values)
decrease of main current versus
junction temperature
2
360°
2
p
1.0
0.10
j
50
(dV/dt)c (V/µs)
pecified]
T (°C)
j
Snubberless and Logic level types
75
10.0
1.00
T835/CW/BW
100
T initial=25°C
j
2
t (ms)
Doc ID 7472 Rev 7
I
T810/SW
p
TSM
I t
2
100.0
10.00
125
Figure 8.
Figure 10. Relative variation of critical rate of
Figure 12. DPAK and D
100
2.5
2.0
1.5
1.0
0.5
0.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
90
80
70
60
50
40
30
20
10
0
-40
0.1
I
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
0
R
GT H L
th(j-a)
,I ,I [T ] /
B
-20
I
H
D PAK
4
& I
2
(°C/W)
L
C
j
DPAK
I
Relative variation of gate trigger
current
decrease of main current versus
(dV/dt)c (typical values)
junction to ambient versus copper
surface under tab
GT
8
0
I
GT H L
printed circuit board FR4, copper thickness: 35 µm
,I ,I [T =25°C]
12
1.0
20
versus junction temperature (typical values)
(dV/dt)c (V/µs)
16
j
holding current and latching current
40
T (°C)
S(cm²)
j
2
20
PAK thermal resistance
60
24
10.0
80
Characteristics
28
100
Standard types
32
120
36
100.0
5/12
140
40

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