1-103169-1 TE Connectivity, 1-103169-1 Datasheet - Page 246

Conn Shrouded Header HDR 26 POS 2.54mm Solder ST Thru-Hole

1-103169-1

Manufacturer Part Number
1-103169-1
Description
Conn Shrouded Header HDR 26 POS 2.54mm Solder ST Thru-Hole
Manufacturer
TE Connectivity
Type
Shrouded Headerr
Datasheet

Specifications of 1-103169-1

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
26
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Rohs Compliant
NO
Product Type
Connector
[shrouded] End Dimension (mm [in])
3.81 [0.150]
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
No
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
With
Mating Connector Lock Type
Detent Windows
Housing Style
4-Sided
Post Size (mm [in])
0.64 [.025]
Profile
Standard
Mating Post Length (mm [in])
8.08 [0.318]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Termination Post Length (mm [in])
3.18 [0.125]
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Shrouded
Number Of Positions
26
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Material
Thermoplastic - GF
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-55 – +105
High Temperature Housing
No
High Speed Serial Data Connector
No
5
246
.025 [0.64] Square
Right-Angle Post
Material and Finish
Housing — Black thermoplastic,
94V-0 rated
Posts — Brass, plated as follows:
Plating A — Duplex plated .000030
[0.00076] gold on contact area, .000100
[0.00254] min. tin on solder area, with
entire post underplated .000050
[0.00127] nickel
Plating B — Duplex plated .000015
[0.00038] gold on contact area, .000100
[0.00254] min. tin on solder area, with
entire post underplated .000050
[0.00127] nickel
Plating C — .000100 [0.00254] tin
over .000050 [0.00127] nickel on entire
post
Related Product Data
Mateable AMPMODU MTE
Products —
Receptacle Assemblies
(Latching) — pages 230, 231
Receptacle Assemblies with Guide
Ribs (installed in Single-Row
Coupling Shroud) —
pages 232, 233, 235, 240
Technical Documents
pages 277, 278
Product Specification
108-25034
Application Specification
114-25026
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
MTE Headers, Shrouded Latching, Single-Row .100 [2.54] Centerline
With Holddown
Without Holddown
[3.05]
[1.52]
[3.05]
.060
.120
.120
[1.52]
.060
[1.52]
[1.52]
.060
.060
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
[8.64±0.08]
*±.003 [±0.08]; tolerance not to accumulate within one connector pattern.
.340±.003
[2.54]
(PC board thickness (for Holddown Feature) is .062±.008 [1.57±0.20])
*±.003 [±0.08]; tolerance not to accumulate within one connector pattern.
.100
[2.54]
.100
Typ.
.100*
[2.54]
Typ.
A
B
C
C
Typ.
A
B
Typ.
X
X
X
X
Recommended PC Board Hole Layout
Recommended PC Board Hole Layout
.100*
[2.54]
Position No. 1 Indicator
[0.89±0.08]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
.035±.003
Typ.
[2.54]
[0.89±0.08]
.100
.035±.003
[2.54]
Position No. 1 Indicator
.100
[13.59]
[5.08]
[13.59]
.200
.535
.535
C
[5.08]
C
.200
Dia. Typ.
[3.40±0.08]
.134±.003
[9.27]
(2 Plc.)
.365
Dia. Typ.
[6.99]
.275
Dia.
[6.99]
.275
[8.89]
.350
Section X-X
[5.84]
.230
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[8.89]
[1.40±0.08]
.350
.055±.003
Section X-X
[5.84]
.230
(Contact Area)
Typ.
[5.08]
.200
(Contact Area)
[5.08]
[3.68]
.200
.145
Ref.
[3.30]
[3.68]
.130
.145
Ref.
[3.30]
.130

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