2106091-1 TE Connectivity, 2106091-1 Datasheet - Page 4

• Manufacturer Part Number: 2106091-1
• Description: Conn Wire to Board RCP 2 POS 1.5mm Solder ST SMD
• Manufacturer: TE Connectivity
• Type: Wire to Boardr
• Series: Inverted SMT Thru Boardr

Specifications of 2106091-1

• Pitch: 1.5 mm
• Number Of Rows: 1
• Number Of Contacts: 2
• Gender: RCP
• Contact Plating: Tin Over Nickel
• Termination Method: Solder
• Connector Type: Wire To Board
• Contact Termination: Surface Mount Vertical
• No. Of Contacts: 2
• No. Of Rows: 1
• Pitch Spacing: 1.5mm
• Rohs Compliant: Yes
• Connector Design: Inverted
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Vertical
• Wire/cable Type: Discrete Wire
• Ul File Number: E28476
• Keyed: No
• Make First / Break Last: No
• Mating Post Length (mm [in]): 2.40 [0.095]
• Contact Current Rating, Max (a): 3
• Operating Voltage (vac): 50
• Operating Voltage (vdc): 50
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 6.90 [0.272]
• Centerline (mm [in]): 1.50 [0.059]
• Number Of Positions: 2
• Length (x-axis) (mm [in]): 9.11 [0.359]
• Width (z-axis) (mm [in]): 7.25 [0.285]
• Post-mating Assembly Measurement (mm [in]): 6.9 [0.272]
• Mating Retention: Without
• Header Mating Direction: Inverted
• Pcb Mount Retention Type: Boardlock(s)
• Tail Plating Material: Matte Tin-Lead over Nickel
• Tail Plating, Thickness (µm [?in]): 4 [157.48]
• Contact Type: Pin
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 4 [157.5]
• Stamped And Formed: Yes
• Connector Style: Receptacle
• Mating Alignment: With
• Housing Material: Liquid Crystal Polymer (LCP)
• Housing Color: Natural
• Ul Flammability Rating: UL 94V-0
• Pass-through Hole Size (mm [in]): 6 x 5 [.236 x .197]
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Printed Circuit Board
• Lighting Interconnect Level: Level 2
• Glow Wire Rating: No
• Uv Exposure Rated: No
• Application Use: Wire-to-Board
• Packaging Method: SMT Pocket Tape

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Part numbers in this brochure are RoHS Compliant*, unless marked otherwise.
*as defined www.tycoelectronics.com/leadfree
Tyco Electronics Corporation
Harrisburg, PA
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© 2009 Tyco Electronics Corporation. All Rights Reserved.
7-1773453-0 3M FP 01/2010
TE (logo) and Tyco Electronics are trademarks of the Tyco Electronics group of companies and its licensors.
Other products, logos, and Company names mentioned herein may be trademarks of their respective owners.
While Tyco Electronics has made every reasonable effort to ensure the accuracy of the information in this catalog, Tyco Electronics does
not guarantee that it is error-free, nor does Tyco Electronics make any other representation, warranty or guarantee that the information is
accurate, correct, reliable or current. Tyco Electronics reserves the right to make any adjustments to the information contained herein at any
time without notice. Tyco Electronics expressly disclaims all implied warranties regarding the information contained herein, including, but
not limited to, any implied warranties of merchantability or fitness for a particular purpose. The dimensions in this catalog are for reference
purposes only and are subject to change without notice. Specifications are subject to change without notice. Consult Tyco Electronics for
the latest dimensions and design specifications.
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