746610-6 TE Connectivity, 746610-6 Datasheet - Page 4

• Manufacturer Part Number: 746610-6
• Description: Conn IDC Connector M 26 POS 2.54mm IDT RA Cable Mount
• Manufacturer: TE Connectivity
• Type: IDC Connectorr
• Series: AMP-LATCH DIP Plugr

Specifications of 746610-6

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 26
• Gender: M
• Contact Plating: Bright Tin-Lead Over Nickel
• Termination Method: IDT
• Peak Reflow Compatible (260 C): No
• Body Material: Thermosplastic
• Size: 1.480 " W
• Leaded Process Compatible: No
• Approval Bodies: UL, CSA
• Connector Type: Wire-to-Board
• Rohs Compliant: No
• Product Line: AMP-LATCH
• Termination Method To Pc Board: Through Hole - Solder
• Pcb Mounting Orientation: Vertical
• Pcb Mount Retention: Without
• Pcb Mount Alignment: Without
• Termination Method To Wire/cable: IDC
• Ul File Number: E28476
• Csa File Number: LR 7189
• Contact - Rated Current (a): 1
• Operating Voltage Reference: AC
• Operating Voltage (vac): 250
• Wire/cable Size (awg): 26 – 30
• Wire/cable Size (mm²): 0.051 – 0.15
• Wire/cable Size (cma): 101 – 296
• Tail Length (mm [in]): 3.96 [0.156]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 6.43 [0.253]
• Number Of Positions: 26
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Length (x-axis) (mm [in]): 37.59 [1.4799]
• Width (z-axis) (mm [in]): 7.06 [0.278]
• Contact Type: Pin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold or Palladium Nickel or Performance Based
• Contact Plating, Mating Area, Thickness (µm [?in]): 2.54 [100]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 2.54 [100]
• Connector Style: Plug
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Ul Voltage Rating (vac): 250
• Operating Temperature (°c [°f]): -65 – +105 [-85 – +221]
• Applies To: Printed Circuit Board
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.81 – 1.07 [0.032 – 0.042]
• Pcb Thickness, Recommended (mm [in]): 3.18 [0.125]
• Application Use: Wire-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tube

4.
4.1.
4.2.
4.3.
4.4.
Rev A
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form , fit or function are m ade to the product or m anufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determ ined by developm ent/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product m eets the requirem ents of Figure 1. Failures
attributed to equipm ent, test setup or operator deficiencies shall not disqualify the product. W hen
product failure occurs, corrective action shall be taken and sam ples resubm itted for qualification.
Testing to confirm corrective action is required before resubm ittal.
Quality Conform ance Inspection
The applicable quality inspection plan will specify the sam pling acceptable quality level to be used.
Dim ensional and functional requirem ents shall be in accordance with the applicable product drawing
and this specification.
Sam ple Selection
Sam ples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. Test group 1 shall consist of 6, 15 position and 6, 60 position
connectors. Test groups 2, 3, 4, and 5 shall each consist of 6, 60 position connectors.
Test Sequence
Qualification inspection shall be verified by testing sam ples as specified in Figure 2.
Term ination Resistance Measurem ent Points
Figure 3
108-40013
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