9-146253-0 TE Connectivity, 9-146253-0 Datasheet - Page 57

• Manufacturer Part Number: 9-146253-0
• Description: Conn Unshrouded Header HDR 80 POS 2.54mm Solder ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: Unshrouded Headerr
• Series: AMPMODU Mod IIr

Specifications of 9-146253-0

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 80
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch Spacing: 2.54mm
• No. Of Rows: 2
• No. Of Contacts: 80
• Contact Termination: Through Hole
• Contact Material: Phosphor Bronze
• Rohs Compliant: Yes
• Agency Approvals: CSA, UL
• Angle: Straight
• Brand/series: AMPMODU/MOD II Series
• Color: Black
• Current, Rating: 3 A
• Flammability Rating: UL94V-0
• Length, Overall: 3.984 "
• Length, Pin: 0.318 "
• Material, Contact: Phosphor Bronze
• Material, Housing: Thermoplastic
• Pin Spacing: 0.1 "
• Primary Type: Interconnect System
• Special Features: Breakaway
• Temperature, Operating: -65 to +105 °C
• Termination: Thru-Hole
• Product Type: Connector
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Surface Mount Compatible: Yes
• Board Standoff: With
• Mounting Ears: Without
• Mating Connector Lock: Without
• Post Size (mm [in]): 0.64 [.025]
• Mating Post Length (mm [in]): 8.08 [0.318]
• Panel Mount Retention: Without
• Current Rating (a): 3
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 3.18 [0.125]
• Solder Tail Contact Plating: Tin over Nickel, Matte Tin over Nickel
• Header Type: Breakaway
• Number Of Positions: 80
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Selectively Loaded: No
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Shape: Square
• Contact Base Material: Phosphor Bronze
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Housing: Yes
• High Speed Serial Data Connector: No
• Lead Free Status / Rohs Status: RoHS Compliant part

Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Parallel PC board stacking
without use of mother boards
Provides space between
boards for interference-free
routing of wire-to-board
connections
Two header heights
available: .785 [19.94] and
1.200 [30.48]
Vertical mount headers are
fully shrouded
Receptacle contacts have
dual cantilever beams with
built-in overstress protection
.025 [0.64] sq. posts and
receptacle contacts on
double-row, .100 x .100
[2.54 x 2.54] centers
Header posts and receptacle
contacts are phosphor
bronze, duplex plated
Housings are made of
flame retardant, glass-filled
thermoplastic
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
AMPMODU Stacking Connectors—Shrouded,
.025 x .025 [0.64 x 0.64] Posts
AMPMODU stacking
connectors are a two-piece
interconnection system
designed for parallel
stacking printed circuit
boards, without the use of
mother boards.
Vertical mount headers and
receptacle assemblies
feature duplex plated posts
and receptacle contacts on
a double-row, .100 x .100
[2.54 x 2.54] grid. The .025
[ 0.64] sq. header posts are
more protected, and the
top-entry receptacle
contacts utilize the proven
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
AMPMODU receptacle
contact design; dual
cantilever beams with built-
in overstress protection.
Headers are available in
two heights: .785 [19.94]
and 1.200 [30.48]. This
allows the customer to
use the height of the header
to keep wire-to-board
connections up and
away from other board
components, particularly if
the components are densely
packaged around the
header.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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