1-534206-3 TE Connectivity, 1-534206-3 Datasheet - Page 14

• Manufacturer Part Number: 1-534206-3
• Description: Conn Socket Strip RCP 26 POS 2.54mm Solder ST Thru-Hole Gang of Tubes
• Manufacturer: TE Connectivity
• Type: Socket Stripr

Specifications of 1-534206-3

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 26
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Peak Reflow Compatible (260 C): No
• Leaded Process Compatible: No
• Mounting Type: PCB Straight Thru Hole
• Connector Type: Board-to-Board
• Rohs Compliant: No
• Product Type: Connector
• Connector Series: Mod II
• Profile: Standard
• Mounting Pattern (mm [in]): 2.54 x 2.54 [.100 x .100]
• Sealed: No
• Holddown Feature: Without
• Pcb Mounting Orientation: Vertical
• Pcb Mount Retention: With
• Termination Method To Pc Board: Through Hole - Solder
• Closed Entry: With
• Board Standoff: With
• Stackable: Yes
• Contact - Rated Current (a): 2
• Contact Resistance (m?): 12
• Insulation Resistance (m?): 5,000
• Dielectric Withstanding Voltage (v): 750
• Termination Post Length (mm [in]): 2.92 [0.115]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Connector Height (mm [in]): 8.12 [0.320]
• Number Of Positions: 26
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Pcb Mount Retention Type: Retention Solder Tails
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: Phosphor Bronze
• Contact Configuration: Short Point
• Housing Entry Style: Top
• Housing Material: Polyester PCT
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Government/industry Qualification: No
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• High Temperature Compatible: No
• Packaging Method: Gang of Tubes

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Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006