1375795-2 TE Connectivity, 1375795-2 Datasheet - Page 14

• Manufacturer Part Number: 1375795-2
• Description: Conn PC/104 and PC/104 Plus Connector RCP 104 POS 2.54mm Press Fit ST Thru-Hole
• Manufacturer: TE Connectivity
• Type: PC/104 and PC/104 Plus Connectorr

Specifications of 1375795-2

• Pitch: 2.54 mm
• Number Of Rows: 4
• Number Of Contacts: 104
• Gender: RCP
• Contact Plating: Gold Over Nickel
• Termination Method: Press Fit
• Pitch Spacing: 2.54mm
• No. Of Rows: 4
• No. Of Contacts: 104
• Contact Termination: Press Fit
• Contact Material: Phosphor Bronze
• Pin Length: 12.27mm
• Rohs Compliant: Yes
• Agency Approvals: cULus
• Angle: Straight
• Brand/series: AMPMODU
• Centerline, Matrix: 0.100 in.
• Color: Black
• Contact Type: Stackthrough
• Current, Rating: 3 A
• Flammability Rating: UL94V-0
• Length, Overall: 81.6 mm
• Length, Pin: 0.483 "
• Length, Terminal Post: 0.483
• Material, Contact: Phosphor Bronze
• Material, Housing: Nylon
• Mounting Hole Size: 1.03/1.1-1.19 mm
• Mounting Type: PCB
• Number Of Positions: 104
• Pin Spacing: 0.1 "
• Plating, Contact Mating Area: Gold over Nickel
• Primary Type: Interconnect System
• Special Features: High Temperature
• Standards: PC/104
• Temperature, Operating: -55 to +105 °C
• Termination: Press Fit
• Product Type: Stackthrough
• Termination Style: Screw
• Housing Material: Nylon, Glass Filled
• Pitch (mm): 2.54mm
• Number Of Contact Rows: 4
• Mounting Style: Through Hole
• Body Orientation: Straight
• Operating Temp Range: -55C to 105C
• Current Rating (max): 3/ContactA
• Contact Resistance Max: 10mOhm
• Housing Color: Black
• Product Height (mm): 11.05mm
• Product Length (mm): 81.6mm
• Product Depth (mm): 9.9mm
• Keyed: No
• Pcb Mount Style: Through Hole Press Fit
• Board Standoff: Without
• Signal Contact Current (a): 3
• Insulation Resistance (m?): 1,000
• Dielectric Withstanding Voltage (v): 500
• Termination Post Length (mm [in]): 12.27 [0.483]
• Number Of Loaded Positions: 104
• Centerline (mm [in]): 2.54 [0.100]
• Pcb Mount Retention Type: Compliant Posts
• Contact Configuration: Stackthrough
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Temperature Range (°c): -55 – +105
• Lead Free Status / Rohs Status: RoHS Compliant part

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Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
High density .050 x .050
[1.27x1.27] centerline grid
Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header allow
for drainage of processing
fluids
Tape and reel packaging
available. Contact
Tyco Electronics for details
Polarized header and recep-
tacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File No. LR7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Vertical Receptacles and Headers
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 19) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide long-term strain relief
for the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
holddown characteristics
Non-Protrusive
Metallic Holddowns
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and
receptacles feature
polarization to prevent
misalignment.
Three Board Stack Heights
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
[9.91±0.15]
[6.35±0.15 ]
[8.13±0.15]
.390±.006
.250±.006
.320±.006