NTMFS5834NLT1G ON Semiconductor, NTMFS5834NLT1G Datasheet

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NTMFS5834NLT1G

Manufacturer Part Number
NTMFS5834NLT1G
Description
MOSFET N-CH 30V 74A SO-8FL
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTMFS5834NLT1G

Input Capacitance (ciss) @ Vds
1231pF @ 20V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
9.3 mOhm @ 20A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
13A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
24nC @ 10V
Power - Max
3W
Mounting Type
*
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTMFS5834NLT1G
Manufacturer:
ON Semiconductor
Quantity:
950
Part Number:
NTMFS5834NLT1G
Manufacturer:
ON/安森美
Quantity:
20 000
NTMFS5834NL
Power MOSFET
40 V, 74 A, 9.3 mW
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad
2. Surface−mounted on FR4 board using 0.155 in sq (100mm
© Semiconductor Components Industries, LLC, 2010
December, 2010 − Rev. 0
MAXIMUM RATINGS
THERMAL RESISTANCE MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Continuous Drain
Current R
(Note 1)
Power Dissipation
R
Pulsed Drain
Current
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (L = 0.1 mH)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Junction−to−Case (Bottom) (Note 1)
Junction−to−Case (Top) (Note 1)
Junction−to−Ambient Steady State
(Note 1)
Junction−to−Ambient Steady State
(Note 2)
Compliant
Low R
Low Capacitance
Optimized Gate Charge
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Cu area = 1.127 in sq [2 oz] including traces).
qJA
qJC
(Note 1)
(Note 1)
DS(on)
qJA
qJC
Parameter
Parameter
Steady
State
(T
J
= 25°C unless otherwise stated)
t
p
= 10 ms
T
T
T
T
T
T
T
T
A
A
C
C
A
A
C
C
= 100°C
= 100°C
= 100°C
= 100°C
= 25°C
= 25°C
= 25°C
= 25°C
Symbol
T
Symbol
R
R
R
R
J
V
EAS
V
, T
IAS
I
qJC
qJC
qJA
qJA
P
P
DSS
DM
T
I
I
I
GS
D
D
S
D
D
L
STG
Value
2
−55 to
Value
1.4
4.5
+150
41
75
) pad size.
±20
276
260
3.0
1.9
40
13
11
74
59
89
57
74
48
31
1
°C/W
Unit
Unit
mJ
°C
°C
W
W
V
V
A
A
A
A
A
†For information on tape and reel specifications,
NTMFS5834NLT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
V
(BR)DSS
40 V
A
Y
WW
G
(Note: Microdot may be in either location)
CASE 488AA
Device
(SO−8FL)
STYLE 1
G (4)
DFN5
ORDERING INFORMATION
N−CHANNEL MOSFET
= Assembly Location
= Year
= Work Week
= Pb−Free Package
1
http://onsemi.com
13.6 mW @ 4.5 V
9.3 mW @ 10 V
D (5,6)
R
DS(ON)
(Pb−Free)
Package
DFN5
Publication Order Number:
MAX
S (1,2,3)
S
S
S
G
MARKING
DIAGRAM
1500/Tape & Reel
NTMFS5834NL/D
AYWWG
5834L
Shipping
D
D
G
I
D
74 A
MAX
D
D

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NTMFS5834NLT1G Summary of contents

Page 1

... (Note: Microdot may be in either location) Symbol Value Unit R 1.4 qJC 4.5 R NTMFS5834NLT1G qJC R 41 °C/W qJA †For information on tape and reel specifications, including part orientation and tape sizes, please R 75 qJA refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. ...

Page 2

ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance CHARGES, CAPACITANCES & ...

Page 3

T = 25° 125 100 DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.050 0.040 0.030 0.020 0.010 0.000 GATE−TO−SOURCE VOLTAGE ...

Page 4

C iss 1200 1000 800 600 C oss 400 200 C rss DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000 ...

Page 5

Duty Cycle = 0.5 0.2 10 0.1 0.05 1 0.02 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 TYPICAL CHARACTERISTICS 0.001 0.01 0.1 PULSE TIME (sec) Figure 13. Thermal Response http://onsemi.com 100 1000 ...

Page 6

... M 3.200 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...

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