CLP-212M Aavid Thermalloy, CLP-212M Datasheet - Page 4

• Manufacturer Part Number: CLP-212M
• Description: CLIP
• Manufacturer: Aavid Thermalloy

Specifications of CLP-212M

• Accessory Type: Clip(s)
• For Use With/related Products: Heat Sinks
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: CLP212M

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www.aavidthermalloy.com
The Max Clip System
The Max Clip System
solution that eliminates mounting holes, screws, rivets, and the thermal inefficiency associated with
using loose hardware to attach components to a heat sink. This quick, robust attachment method
saves on labor and hardware costs while increasing performance and design flexibility.
The Max Clip System
have no mounting holes. Max Clips apply consistent optimum pressure at the center of the semicon-
ductor, improving contact with the heat sink for better thermal performance and maximum compo-
nent reliability. Aavid offers approximately 50 extrusion profiles that accept over 20 different Max Clips
to suit your application. The Max Clip System
packages including TO-220, TO-218, TO-247, TO-3P, and packages without mounting holes like TO-262,
TO-273, TO-274, and TO-251.
Features and Benefits of The Max Clip System
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The Max Clip System
The Max Clip System™ provides ideal product lifetime contact to the center of the device package
resulting in even force across the interface material. Max Clips maintain a constant assembly force even
when interface material deteriorates over time. With conventional nuts, bolts and rivets mounting force
is set at the time of assembly and can lessen over the product’s service life with changes in interface
material thickness. Nuts and bolts also impart force at one end of the package creating uneven
pressure over the length of the device, actually creating thermal inefficiency. See Figure 1.
Figure 1
Poor Contact
Optimizes thermal management of power transistors
Provides mounting for discrete power devices with or without mounting holes
Reduce labor costs by eliminating the need for drilled or tapped holes in heat sinks
Allows flexibility for moving or changing devices
Provides consistent mounting force for reduced thermal resistivity (over lifetime)
Assembly costs using The Max Clip System
hardware such as screws/nuts
AMERICA
MINIMIZE LABOR...MAXIMIZE PERFORMANCE
EUROPE
TM
Advantages
TM
TM
TM
Tightly Torqued
for discrete power semiconductors is a high performance, low cost thermal
is also the most effective system for mounting power devices in packages that
is patented throughout North America, Europe and Asia.
Italy Tel: [phone] email: [e-mail]
United Kingdom Tel: [phone] email: [e-mail]
USA Tel: [phone] email: [e-mail]
The Max Clip System
Air Gap
TM
is designed to accommodate a variety of semiconductor
TM
TM
include:
are lower than with conventional
Maximum Contact
ASIA
TM
Singapore Tel: [phone] email: [e-mail]
Taiwan Tel: [phone] email: [e-mail]
Max Clip