9890 1 IN X 36 YD 3M, 9890 1 IN X 36 YD Datasheet - Page 4

• Manufacturer Part Number: 9890 1 IN X 36 YD
• Description: THERM COND ADH 10MIL 1"X36YD
• Manufacturer: 3M
• Type: Acrylic Adhesiver

Specifications of 9890 1 IN X 36 YD

• Size / Dimension: 1.00" W x 36 yd Roll
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 3M9592; 70006178894

3M
9882 • 9885 • 9890
General Information
Product selection table for 3M™ Thermally Conductive Materials.
Application Guidelines
6.) Rework Tips:
Application Ideas
3M™ Thermally Conductive Adhesive Transfer Tapes 9882, 9885, and 9890 are designed to provide a preferential heat-
transfer path between heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
Only the “S” versions are available in 0.5 mm thicknesses.
“S” designation signifies a polyester film on one side to provide a non-tacky surface.
“H” designation signifies a product with one one-tacky surface without the use of PET film.
3M™ Thermally Conductive Pads
3M™ Thermally Conductive Pads (Acrylic)
3M™ Thermally Conductive Epoxy Adhesives
3M™ Thermally Conductive Tapes
DP-190 Gray
5516/5516S
5519/5519S
5592/5592S
5595/5595S
• Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying,
• Heating up the substrates can reduce the adhesion level and make removal easier.
• Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make
™
TC-2707
TC-2810
Product
torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-
cleaned according to the recommendations in this data page.
prying, torquing or peeling apart the substrates easier.
9889FR
5591S
5589H
5590H
8805
8810
8815
8820
Thermally Conductive Adhesive Transfer Tapes
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5, 2.0
0.5, 1.0, 1.5
Thickness
1.0, 1.5
(mm)
0.127
0.375
0.25
0.50
—
—
—
1.0
(continued)
Bulk Thermal
Conductivity
(W/m-K)
0.7
1.0
0.4
3.1
4.9
1.0
1.1
1.6
2.0
3.0
0.6
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
plasma display, IC packages and PCB bonding to heat sinks, metal cases
and other cooling devices.
Applications requiring gap filling and superior thermal performance
without bonding. IC package and PCB thermal interfacing with heat sinks
or other cooling devices and metal cases.
These pads use an acrylic elastomer for applications that require a non-
silicone thermal pad. Provides IC package and PCB thermal interfacing
with heat sinks or other cooling devices, and metal cases.
Applications requiring high adhesive strength, good surface wet-out, gap
filling and good thermal transfer. Provides IC package and PCB thermal
interfacing with heat sinks or other cooling devices.
(4)
Typical Applications