APF30-30-10CB CTS Thermal Management Products, APF30-30-10CB Datasheet - Page 2
![HEATSINK LOW-PROFILE FORGED](/photos/5/88/58800/apf30-30-10cb_sml.jpg)
APF30-30-10CB
Manufacturer Part Number
APF30-30-10CB
Description
HEATSINK LOW-PROFILE FORGED
Manufacturer
CTS Thermal Management Products
Series
APFr
Datasheet
1.APF19-19-06CB.pdf
(2 pages)
Specifications of APF30-30-10CB
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
30.00mm x 30.00mm
Height
0.37" (9.40mm)
Thermal Resistance @ Forced Air Flow
3.3°C/W @ 200 LFM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Natural
-
Other names
294-1153
IERC a CTS Company
Page 2 of 2
Part Number Series
Dimensions in mm (L x W x H)
Commercial Black Anodize
Mounting Options
Adhesive
Double-sided Kapton®
Chomerics Thermattach®
Example:
APF19-19-10CB/A01
413 North Moss Street
APF 19-19-10 CB /A01
“/A01”
“T410, T411, or T412”
HOW TO ORDER?
Burbank, CA 91502
818-842-7277
www.ctscorp.com
October 2006