217-36CT6 Wakefield Thermal Solutions, 217-36CT6 Datasheet

HEATSINK DPAK SMT TIN PLATED

217-36CT6

Manufacturer Part Number
217-36CT6
Description
HEATSINK DPAK SMT TIN PLATED
Manufacturer
Wakefield Thermal Solutions
Series
217r
Datasheets
1.274-2AB.pdf (20 pages)
2.274-1AB.pdf (23 pages)

Specifications of 217-36CT6

Thermal Resistance
16 C / W
Height
0.360" (9.14mm)
Package Cooled
D²Pak
Attachment Method
SMD Pad
Outline
18.80mm x 15.20mm
Power Dissipation @ Temperature Rise
1W @ 55°C
Thermal Resistance @ Forced Air Flow
16.0°C/W @ 200 LFM
Thermal Resistance @ Natural
55°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Copper
Fin Style
Folded
Dimensions
15.24 mm L x 18.8 mm W x 9.91 mm H
Designed For
D2Pak, TO-220, SOT-223, SOL-20
Packages Cooled
SOL-20 / SOT-223 / TO-220
Width
18.8mm
Heat Sink Material
Copper
Peak Reflow Compatible (260 C)
No
Length
15.2mm
Size
0.390H X 0.600W X 0.740D"
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
Other names
345-1012
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Standard
P/N
217-36CTE6
217-36CTTE6
217-36CTRE6
Material: Copper, Matte Tin Plated
22
Board Level
Heat Sinks
MECHANICAL DIMENSIONS
6/14/07
217-36CT6
Height Above
.360 (9.1)
.360 (9.1)
.360 (9.1)
PC Board
in. (mm)
10:54 AM
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Dimensions
Page 22
Footprint
in. (mm)
217 HEAT SINK WITH
DDPAK DEVICE
REEL DETAILS
SECTION A-A
KEY:
217 SERIES
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
í
Tape & Reel
Package
Device only, NC
Format
Bulk
Tube
Surface Mount Heat Sinks
v
Device + HS, NC
Package
Quantity
250
20
1
Device Power Dissipation. W
125°C LEAD, 40°C AMBIENT
TAPE DETAILS
THERMAL PERFORMANCE
6 LAYER BOARD, D ' PAK
Device + HS, 100 lfm
Convection
55°C @ 1W
55°C @ 1W
55°C @ 1W
Natural
Thermal Performance at Typical Load
„
Device + HS, 200 lfm
Dimensions: in.
D
2
PAK, TO-220, SOT-223, SOL-20
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
Convection)
Device + HS, 300 lfm
Forced

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217-36CT6 Summary of contents

Page 1

... Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS 217-36CT6 22 Surface Mount Heat Sinks 217 SERIES Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari- ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas- ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications ...

Page 2

... Solid line = 218-40CT5 218-40CT5 Board Level Heat Sinks D 2 PAK, TO-220, SOL-20 217-36CT6 SMT Devices Thermal Performance at Typical Load Natural Convection Forced Convection 62°C rise @ 2W 21°C/W @ 200LFM 62°C rise @ 2W 21°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS AIR VELOCITY (LFM) ...

Page 3

WTS001_p1-25 6/14/07 10:54 AM Page 24 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 206 SERIES Standard P/N 206-1PABEH Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 230 & 234 SERIES Height Above Standard PC Board ...

Page 4

WTS001_p1-25 6/14/07 10:54 AM Page 25 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 241 SERIES Standard P/N 241-69ABE-03 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 262 SERIES Standard P/N 262-75ABE-05 262-75ABE-01 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Horizontal Mount Heat Sink Height ...

Page 5

WTS001_p26-49 6/14/07 10:55 AM Page 26 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 & 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60ABE-01 .600 (15.2) 233-60ABE-05 .500 (12.7) 233-60ABE-10 .725 (18.4) ...

Page 6

WTS001_p26-49 6/14/07 10:55 AM Page 27 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Height Above Standard P/N 235-85AB 235-85ABE-01 235-85ABE-05 235-85ABE-10 PATENT 5381041 Material: Aluminum, Black Anodized 235-85AB-05 243 SERIES Height Above Standard P/N 243-1PAB 243-3PAB Material: Aluminum, Pre-anodized ...

Page 7

WTS001_p26-49 6/14/07 10:55 AM Page 28 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Vertical Mount Heat Sink 265 SERIES Standard P/N 265-118ABHE-22 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 286DB SERIES Standard P/N 286DBE Material: Aluminum, Black Anodized ...

Page 8

WTS001_p26-49 6/14/07 10:55 AM Page 29 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Height Above Standard P/N 273-AB 273-ABE-01 273-ABE-02 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 273-AB 274 & 281 SERIES Height Above Standard P/N 274-1AB 274-1ABE-01 274-1ABE-02 274-2AB ...

Page 9

WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks 242 SERIES Height Above Standard PC Board P/N in. (mm) 242-125ABE-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 ...

Page 10

WTS001_p26-49 6/14/07 10:55 AM Page 31 BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Standard P/N 244-145AB 244-145ABE-50 1.650 (41.9) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N 245-145AB 245-145ABE-50 1.650 (41.9) ...

Page 11

WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks 247 SERIES Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 ...

Page 12

WTS001_p26-49 6/14/07 10:55 AM Page 33 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Standard P/N 288-1ABE Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconduc- tor packages. ...

Page 13

WTS001_p26-49 6/14/07 10:55 AM Page 34 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Height Above Standard PC Board P/N in. (mm) 270-AB 0.375 (9.4) 272-AB 0.375 (9.4) 280-AB 0.375 (9.4) Material: Aluminum, Black Anodized These ...

Page 14

WTS001_p26-49 6/14/07 10:55 AM Page 35 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES Standard P/N 250-122AB 250-122ABE-09 250-122ABE-25 Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 250-122AB Dimensions: in. (mm) 237 & 252 SERIES Standard P/N 237-167AB2 237-167AB3 237-167ABE2-24 1.675 (42.5) ...

Page 15

WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks 286 SERIES See also 286DB Series on Page 7. Height Above Standard PC Board P/N in. (mm) ...

Page 16

WTS001_p26-49 6/14/07 10:55 AM Page 37 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with ...

Page 17

WTS001_p26-49 6/14/07 10:56 AM Page 38 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Epoxy Insulated For TO-5 260 SERIES 260-4T5E Thermal Links for Fused Glass Diodes 258 SERIES Standard P/N 258 0.500 (12.7) x 0.250 (6.4) x ...

Page 18

WTS001_p26-49 6/14/07 10:56 AM Page 39 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Standard Plain Pin 634-10ABEP 634-15ABEP 634-20ABEP Material: Aluminum, Black Anodized. These slim profile unidirectional fin heat sinks offer users two assembly alternatives for verti- cally mounting ...

Page 19

WTS001_p26-49 6/14/07 10:56 AM Page 40 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting 667 SERIES Standard P/N Standoff Pin Plain Pin 667-10ABESP 667-10ABPP 667-15ABESP 667-15ABPP 667-20ABESP 667-20ABPP 667-25ABESP 667-25ABPP ...

Page 20

WTS001_p26-49 6/14/07 10:56 AM Page 41 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 647 SERIES Standard P/N 647-1OABEP 647-15ABEP 647-175ABEP 647-20ABEP 647-25ABEP Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit ...

Page 21

WTS001_p26-49 6/14/07 10:56 AM Page 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS High-Performance Notched Heat Sinks for Vertical Board Mounting 657 SERIES Standard P/N 657-10ABEPN 657-15ABEPN 657-20ABEPN 657-25ABEPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...

Page 22

WTS001_p26-49 6/14/07 10:56 AM Page 43 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES Standard P/N 690-3B 690-66B 690-220B Material: Aluminum, Black Anodized These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available ...

Page 23

WTS001_p26-49 6/14/07 10:56 AM Page 44 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 & 603 SERIES Footprint Standard Dimensions P/N in. (mm) 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 ...

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