271-AB Wakefield Thermal Solutions, 271-AB Datasheet - Page 12
271-AB
Manufacturer Part Number
271-AB
Description
HEATSINK TO-220 TOP MNT BLK
Manufacturer
Wakefield Thermal Solutions
Series
271r
Specifications of 271-AB
Thermal Resistance
5.1 C / W
Height
0.500" (12.70mm)
Color
Black
Package Cooled
TO-220
Attachment Method
Bolt On
Outline
44.45mm x 17.78mm
Power Dissipation @ Temperature Rise
4W @ 62°C
Thermal Resistance @ Forced Air Flow
5.1°C/W @ 400 LFM
Thermal Resistance @ Natural
15.5°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
44.45 mm L x 9.53 mm W x 36.25 mm H
Designed For
TO-220
Packages Cooled
TO-220
Width
17.8mm
Heat Sink Material
Aluminum
Length
44.5mm
Mounting Type
Screw
Size
1.75L X 0.500H X 0.700W"
Package / Case
TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1042
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-
drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards.
Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
MECHANICAL
DIMENSIONS
Normally stocked
286 SERIES
Standard
P/N
286-AB
286-CBT
286-CT
287 SERIES
Mounting Slot
287-1AB
287-2AB
Material: Aluminum, Black Anodized
695 SERIES
Standard
P/N
695-1B
Mount and effectively heat sink small stud-mounted diodes with the 695 Series
space-saving heat sink type. Each unit is black anodized aluminum with an
0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
Standard P/N
Height Above
1.190 (30.2)
1.190 (30.2)
1.190 (30.2)
PC Board
in. (mm)
Mounting Hole
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Wave-Solderable Low-Cost Heat Sinks
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
287-1ABH
287-2ABH
1.330 (33.8)
Maximum
in. (mm)
Width
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 0.500 (12.7)
Maximum Footprint
Height Above
1.180 (30.0)
1.180 (30.0)
in. (mm)
PC Board
in. (mm)
0.530 (13.7)
695 SERIES
in. (mm)
Height
286 SERIES
1.000 (25.4) x 0.500 (12.7)
1.000 (25.4) x 1.000 (25.4)
41
Aluminum, Anodized
Footprint “A”
Copper, Tinned
t y. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum,
Maximum
black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned).
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
Copper, Black
in. (mm)
287 SERIES
Material
Standard P/N
287-1AB
287-2AB
287-1ABH
287-2ABH
72°C @ 4.0W
Convection
Thermal Performance at Typical Load
Natural
provides good heat dissipation for use where height is limited above the print-
ed circuit board or base plate.
0.500 (12.7)
1.000 (25.4)
0.500 (12.7)
1.000 (25.4)
All other products, please contact factory for price, delivery, and minimums.
Dim. “A”
58°C @ 4W
58°C @ 4W
58°C @ 4W
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
55°10 @ 4W
65°C @ 4W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
5.2°C/W @ 400 LFM
NATURAL AND FORCED
NATURAL AND FORCED
NATURAL AND FORCED
Convection
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
7.4°CW @ 200 LFM
Forced
7.8°CW @ 200 LFM
6.4°CW @ 200 LFM
Convection
Convection
Forced
Forced
Board Level
Heat Sinks
0.0250 (11.34)
0.0250 (11.34)
0.0090 (4.08)
0.0140 (6.35)
0.0085 (3.86)
lbs. (grams)
STUD-MOUNT
lbs. (grams)
0.0030 (1.36)
Weight
lbs. (grams)
TO-220
Weight
TO-220
Weight