374424B00035G Aavid Thermalloy, 374424B00035G Datasheet - Page 4

HEATSINK BGA W/ADHESIVE TAPE

374424B00035G

Manufacturer Part Number
374424B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer
Aavid Thermalloy
Datasheet

Specifications of 374424B00035G

Package Cooled
BGA
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.00mm x 27.00mm
Height
0.709" (18mm)
Power Dissipation @ Temperature Rise
4W @ 80°C
Thermal Resistance @ Forced Air Flow
6.5°C/W @ 200 LFM
Thermal Resistance @ Natural
20.3°C/W
Product
Heatsinks
Mounting Style
Adhesive
Heatsink Material
Plastic
Fin Style
Pin
Thermal Resistance
20.3 C / W
Dimensions
27 mm L x 27 mm W x 18 mm H
Designed For
BGA
Color
Black
Packages Cooled
BGA
External Width - Metric
27mm
External Height - Metric
18mm
External Length - Metric
27mm
Heat Sink Material
Plastic
Length
27mm
Mounting Type
Adhesive
Rohs Compliant
Yes
Body Plating
Anodized
External Width - Imperial
1.063"
External Height - Imperial
0.709"
External Length - Imperial
1.063"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
374424B00035
HS319
Q5390134
3
PUSH PIN ATTACHMENT METHOD
* See bottom of page 4 for information on how to use this table
* See bottom of page 4 for information on how to use this table
CLIP ATTACHMENT METHOD
Part Number
2317B-EP11-BGS1
2518B-EP11-BGS2
2519B-EP11-BGS5
2522B-EP04-BGS5
2520B-EP04-BGS5
Part Number
10-6326-27
10-6326-28
10-6327-01
10-TNT2-01
10-5597-02
10-5597-22
10-5597-33
10-5607-04
10-5607-05
372924M02000
10-L4LB-03
10-L4LB-05
10-L4LB-11
Refer to page 4 for PCB hole Patterns
Copyright © Aavid Thermalloy, LLC. April 2002
Width Length Height *θ n
28.0
28.0
28.5
36.1
37.4
37.4
37.4
37.4
37.4
37.4
41.4
41.4
41.4
Width Length Height *θ n *θ f *Finish
26.1
30.5
34.5
38.1
38.1
28.0
28.0
28.5
48.0
37.4
37.4
37.4
37.4
37.4
37.4
45.2
45.2
45.2
FOR ADDITIONAL TECHNICAL INFORMATION VISIT OUR WEB SITE AT WWW.AAVIDTHERMALLOY.COM/BGA
20.5
28.1
31.4
38.0
38.0
ITEMS SHOWN IN RED ARE AVAILABLE FROM AAVID THERMALLOY’S AUTHORIZED DISTRIBUTORS
10.0
11.6
10.0
10.0
11.7
11.7
11.7
6.0
6.0
6.0
6.0
6.0
6.0
15.2
15.6
15.6
10.2
15.6
44.1
44.1
30.6
18.8
33.3
33.3
33.3
22.1
22.1
32.6
16.7
16.7
14.2
32.6
22.7
19.7
22.1
15.6
13.13
13.13
9.26
6.13
9.91
9.91
9.91
6.99
6.99
9.91
5.60
5.60
4.91
*θ f
9.94
7.05
6.30
6.94
5.17
*Finish *Fig.
M
M
M
M
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
C
C
D
D
D
D
D
D
F
E
E
E
Corporate Office: Concord, NH • USA
W
FEATURES AND BENEFITS
• Configurations are available for a wide range
• All Heat Sinks utilize industry standard
• Plastic push pins are standard. Consult Aavid
• Each Heat Sink utilizes a Phase Change Pad as
• Minimal diameter holes are necessary
FEATURES AND BENEFITS
• A unique clip eliminates the need for
• Each Heat Sink utilizes a Phase Change Pad as
• The clips unique design eliminates the need
• The Clips are available in industry standard
of BGA Package sizes
hole patterns
Thermalloy for versions available with brass
push pins for more rugged applications
the interface for Optimal Thermal Performance
for mounting to PC Board
mounting holes in the PC Board
the interface for optimal thermal performance
for thermal tape attachment
sizes to fit a wide variety of BGA package sizes
L
L
W
Tel: (603)224-9988
H
H

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