658-35AB Wakefield Thermal Solutions, 658-35AB Datasheet - Page 2

• Manufacturer Part Number: 658-35AB
• Description: HEATSINK CPU 28MM SQBLK W/O TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-35AB

• Height: 0.35" (9mm)
• Color: Black
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 27.94mm x 27.94mm
• Power Dissipation @ Temperature Rise: 2W @ 50°C
• Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 8.89 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Packages Cooled: BGA / LED
• Width: 27.9mm
• Length: 27.9mm
• Mounting Type: Adhesive
• Package / Case: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1066

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
30
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
200
200
300
Approach Velocity, LFM
300
Approach Velocity, LFM
PRODUCT FEATURES
PRODUCT FEATURES
400
400
624-25-T4
624-35-T4
624-45-T4
624-60-T4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
500
500
600
600