637-20ABP Wakefield Thermal Solutions, 637-20ABP Datasheet
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637-20ABP
Specifications of 637-20ABP
Related parts for 637-20ABP
637-20ABP Summary of contents
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Height Above Footprint Standard PC Board Dimensions P/N in. (mm) in. (mm) 217-36CT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTT6 .390 (9.9) .600 (15.2) x .740 (18.8) 217-36CTR6 .390 ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks MECHANICAL DIMENSIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Height Above Standard PC Board P/N in. (mm) 233-60AB .600 (15.2) 233-60AB-01 .600 (15.2) 233-60AB-05 .500 (12.7) 233-60AB-10 .725 (18.4) PATENT PENDING 236-150AB 1.500 (38.1) 236-150AB-01 ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above Standard PC Board P/N in. (mm) 235-85AB .850 (21.6) 235-85AB-01 .850 (21.6) 235-85AB-05 .500 (12.7) 235-85AB-10 .975 (24.8) PATENT 5381041 Material: Aluminum, Black Anodized ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 273-AB .375 (9.5) 273-AB-01 .375 (9.5) 273-AB-02 .375 (9.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 242-125AB-22 1.285 (32.6) Material: Aluminum, Black Anodized 242-125AB-22 MECHANICAL DIMENSIONS 232 AND 238 SERIES Height Above Standard PC ...
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Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 244-145AB 1.450 (36.8) 244-145AB-50 1.650 (41.9) Material: Aluminum, ...
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BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND M 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above Standard PC Board P/N in. (mm) 247-195AB 1.950 (49.5) 247-195AB-50 1.950 (49.5) Order SpeedClip™ 285SC or 330SC separately. ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N 288-1AB Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Height Above Standard PC Board P/N in. (mm) 270-AB 0.375 (9.4) 272-AB 0.375 (9.4) 280-AB 0.375 (9.4) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Height Above Standard PC Board P/N in. (mm) 250-122AB 1.220 (31.0) 250-122AB-09 1.220 (31.0) 250-122AB-25 1.380 (35.1) Material: Aluminum, Black ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 286-AB 1.190 (30.2) 286-CBT 1.190 (30.2) 286-CT 1.190 (30.2) Efficient heat removal at low cost can be ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height (Less Standard Mounting Tab) P/N in. (mm) 256-DM 0.190 (4.0) Cup Clips for TO-5 Case Style Semiconductors 260 SERIES Characteristics Thermal Resistance – Epoxy Insulated ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors Single-Level Star 201, 202,204,205, 211 Series Available Semiconductor Heat Sink Standard P/N Case Diameter Inside Dia. & Finish Min/Max Types in. (mm) in. ...
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... PC Board “A” P/N 637-10ABP 1.000 (25.4) 637-15ABP 1.500 (38.1) 637-20ABP 2.000 (50.8) 637-25ABP 2.500 (63.5) Material: Aluminum, Black Anodized Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight MECHANICAL DIMENSIONS Dimensions: in ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard Standard P/N 626-10ABP 627-10ABP 626-15ABP 627-15ABP 626-20ABP 627-20ABP 626-25ABP 627-25ABP Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting Standard P/N 657-10ABPN 657-15ABPN 657-20ABPN 657-25ABPN Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 657 SERIES High-Performance Heat Sinks with SpeedClips™ ...
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Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above Standard P/N 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized These low-cost heat sinks provide ...
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BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Standard Dimensions P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, ...