658-60ABT1 Wakefield Thermal Solutions, 658-60ABT1 Datasheet - Page 9
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658-60ABT1
Manufacturer Part Number
658-60ABT1
Description
HEATSINK CPU 28MM SQ BLK W/TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-60ABT1
Height
0.600" (15.20mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
3°C/W @ 300 LFM
Packages Cooled
BGA / LED
Width
27.9mm
Length
27.9mm
Mounting Type
Adhesive
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 15.24 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1073
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500