624-25ABT4 Wakefield Thermal Solutions, 624-25ABT4 Datasheet - Page 11
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624-25ABT4
Manufacturer Part Number
624-25ABT4
Description
HEATSINK CPU 21MM SQ W/DBL TAPE
Manufacturer
Wakefield Thermal Solutions
Series
624r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 624-25ABT4
Height
0.250" (6.35mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
21.00mm x 21.00mm
Thermal Resistance @ Forced Air Flow
25°C/W @ 200 LFM
Packages Cooled
BGA / LED
Width
21mm
Heat Sink Material
Aluminum
Length
21mm
Mounting Type
Adhesive
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
Screw
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
21 mm L x 21 mm W x 6.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1059
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
100
100
200
200
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
500
500
600
600
700
700
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
14
12
10
8
6
4
2
0
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
7
6
5
4
3
2
1
0
10
100
9
8
7
6
5
200
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
400
400
400
610-35AB
400
400
400
500
500
500
500
500
500
600
600
600
600
600
600
700
700
700
700
700
700
14
12
10
8
6
4
2
0