2519B-EP11-BGS5G Aavid Thermalloy, 2519B-EP11-BGS5G Datasheet - Page 4

• Manufacturer Part Number: 2519B-EP11-BGS5G
• Description: HEATSINK BGA W/CLIP
• Manufacturer: Aavid Thermalloy

Specifications of 2519B-EP11-BGS5G

• Package Cooled: BGA
• Attachment Method: Clip
• Outline: 34.50mm x 31.40mm
• Height: 0.62" (15.75mm)
• Power Dissipation @ Temperature Rise: 1W @ 20°C
• Thermal Resistance @ Forced Air Flow: 6.3°C/W @ 200 LFM
• Thermal Resistance @ Natural: 19.7°C/W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 2519B-EP11-BGS5; HS309

3
PUSH PIN ATTACHMENT METHOD
* See bottom of page 4 for information on how to use this table
* See bottom of page 4 for information on how to use this table
CLIP ATTACHMENT METHOD
Part Number
2317B-EP11-BGS1
2518B-EP11-BGS2
2519B-EP11-BGS5
2522B-EP04-BGS5
2520B-EP04-BGS5
Part Number
10-6326-27
10-6326-28
10-6327-01
10-TNT2-01
10-5597-02
10-5597-22
10-5597-33
10-5607-04
10-5607-05
372924M02000
10-L4LB-03
10-L4LB-05
10-L4LB-11
Refer to page 4 for PCB hole Patterns
Copyright © Aavid Thermalloy, LLC. April 2002
Width Length Height *θ n
28.0
28.0
28.5
36.1
37.4
37.4
37.4
37.4
37.4
37.4
41.4
41.4
41.4
Width Length Height *θ n *θ f *Finish
26.1
30.5
34.5
38.1
38.1
28.0
28.0
28.5
48.0
37.4
37.4
37.4
37.4
37.4
37.4
45.2
45.2
45.2
FOR ADDITIONAL TECHNICAL INFORMATION VISIT OUR WEB SITE AT WWW.AAVIDTHERMALLOY.COM/BGA
20.5
28.1
31.4
38.0
38.0
ITEMS SHOWN IN RED ARE AVAILABLE FROM AAVID THERMALLOY’S AUTHORIZED DISTRIBUTORS
10.0
11.6
10.0
10.0
11.7
11.7
11.7
6.0
6.0
6.0
6.0
6.0
6.0
15.2
15.6
15.6
10.2
15.6
44.1
44.1
30.6
18.8
33.3
33.3
33.3
22.1
22.1
32.6
16.7
16.7
14.2
32.6
22.7
19.7
22.1
15.6
13.13
13.13
9.26
6.13
9.91
9.91
9.91
6.99
6.99
9.91
5.60
5.60
4.91
*θ f
9.94
7.05
6.30
6.94
5.17
*Finish *Fig.
M
M
M
M
B
B
B
B
B
B
B
B
B
B
B
B
B
B
C
C
C
D
D
D
D
D
D
F
E
E
E
Corporate Office: Concord, NH • USA
W
FEATURES AND BENEFITS
• Configurations are available for a wide range
• All Heat Sinks utilize industry standard
• Plastic push pins are standard. Consult Aavid
• Each Heat Sink utilizes a Phase Change Pad as
• Minimal diameter holes are necessary
FEATURES AND BENEFITS
• A unique clip eliminates the need for
• Each Heat Sink utilizes a Phase Change Pad as
• The clips unique design eliminates the need
• The Clips are available in industry standard
of BGA Package sizes
hole patterns
Thermalloy for versions available with brass
push pins for more rugged applications
the interface for Optimal Thermal Performance
for mounting to PC Board
mounting holes in the PC Board
the interface for optimal thermal performance
for thermal tape attachment
sizes to fit a wide variety of BGA package sizes
L
L
W
Tel: [phone]
H
H