218-40CT5 Wakefield Thermal Solutions, 218-40CT5 Datasheet - Page 2
![HEATSINK ALUM NATURAL SMD](/photos/5/90/59090/wakefield_engineering-_218-40ct5_sml.jpg)
218-40CT5
Manufacturer Part Number
218-40CT5
Description
HEATSINK ALUM NATURAL SMD
Manufacturer
Wakefield Thermal Solutions
Series
218r
Specifications of 218-40CT5
Height
0.4" (10.16mm)
Package Cooled
SMD
Attachment Method
SMD Pad
Outline
26.16mm x 12.70mm
Power Dissipation @ Temperature Rise
2W @ 52°C
Thermal Resistance @ Forced Air Flow
21°C/W @ 200 LFM
Thermal Resistance @ Natural
31°C/W
Packages Cooled
TO-218 / TO-220
Thermal Resistance
31°C/W
Width
26.2mm
Heat Sink Material
Copper
Mounting Type
PC Board Surface Mount
Length
12.7mm
Body Plating
Matte Tin
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Folded
Dimensions
26.16 mm L x 12.7 mm W x 10.16 mm H
Designed For
SMT Devices
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
21840CT5
345-1083
345-1083
WTS001_p1-25
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
MECHANICAL DIMENSIONS
Dimensions: in.
217 SERIES
TUBE: 16.25 Inches Long,
20 Pieces per Tube
6/14/07
MECHANICAL DIMENSIONS
Min. ESD Material with Nail
Stops
TUBE DETAILS
217-36CTT6
10:54 AM
218-40CT3
Surface Mount Heat Sinks
Standard
P/N
218-40CTE3
218-40CTE5
Material: Copper, Matte Tin Plated
218 SERIES
Page 23
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
Surface Mount Heat Sink
BOARD LAYOUT RECOMMENDATIONS
Height Above
PC Board
.40 (10.2)
.40 (10.2)
in. (mm)
218-40CT5
1.03 (26.2) x .50 (12.7)
.90 (22.9) x .315 (8.0)
Maximum
Footprint
in. (mm)
SOL 20
100
80
60
40
20
0
Solid line = 218-40CT5
0
0
200
200
CONVECTION CHARACTERISTICS
0.5
Natural Convection
62°C rise @ 2W
62°C rise @ 2W
HEAT DISSIPATED (WATTS)
NATURAL AND FORCED
AIR VELOCITY (LFM)
400
400
1.0
Thermal Performance at Typical Load
Dashed Line = 218-40CT3
600
600
1.5
800
800
2.0
217-36CT6
D
1000
1000
2.5
2
PAK, TO-220, SOL-20
Board Level
21°C/W @ 200LFM
21°C/W @ 200LFM
Forced Convection
25
20
15
10
5
0
Heat Sinks
SMT Devices
23