PSC2-3CB CTS Thermal Management Products, PSC2-3CB Datasheet - Page 17

• Manufacturer Part Number: PSC2-3CB
• Description: HEATSINK CLIP ON BLACK TO-220
• Manufacturer: CTS Thermal Management Products
• Series: PSC2r

Specifications of PSC2-3CB

• Package Cooled: TO-220
• Attachment Method: Clip
• Outline: 25.40mm x 7.87mm
• Height: 0.81" (20.57mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -
• Other names: 294-1048

ORDERING INFORMATION
Machined ZIF Enclosures are custom designed to
meet customer specifications. Please contact CTS
SPECIFICATIONS
.914mm
.036”
(Screwdriver Slot Drive)
7.938mm
.3125”
(Pin Drive)
Fig. 2
Fig. 1
Zero-Insertion Force
.125”
3.175mm
.250”
6.35mm
ROD STYLES
Unlocked,
Position
To Lock
(ZIF)
3 / 16
Visual Identification Slot
(Hexhead Drive)
CIRCUIT CARD
COLDWALL CONFIGURATION
Fig. 3
ASSEMBLY
ZIF OPERATION
Thermal Management
.150”
3.81mm
.250”
6.35mm
Mounting Surface
Circuit Board or
Cold Wall or
INSERTION
Cam Shaft
MAX. PCB
Housing
Frame
Spring
Applications Engineering Department in Burbank,
California for technical assistance.
COLDWALL
Finned areas can be
Cooling area can be
natural convection.
THERMAL IMPEDANCE:
MINIMUM PCB SPACING (inches):
MINIMUM BOARD THICKNESS:
forced air, liquid or
machined in where
Locked, Maximum
Clamping Force
Board to sink: 1.28°C-Inch/Watt
Center to center: .375” + PCB thickness
.050”
necessary.
To Unlock
Position
MIN. ZIF TO
HEAT SINK
9.398mm
.370”
6.096mm
.240”
CTS
17
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