624-45AB Wakefield Thermal Solutions, 624-45AB Datasheet - Page 18

HEATSINK CPU 21MM SQ W/OUT ADH

624-45AB

Manufacturer Part Number
624-45AB
Description
HEATSINK CPU 21MM SQ W/OUT ADH
Manufacturer
Wakefield Thermal Solutions
Series
624r
Datasheet

Specifications of 624-45AB

Height
0.45" (11.43mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.00mm x 21.00mm
Packages Cooled
BGA / LED
Width
21mm
Heat Sink Material
Aluminum
Length
21mm
Mounting Type
Clip-On
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
21 mm L x 21 mm W x 11.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q1897442

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
624-45AB
Manufacturer:
WAK
Quantity:
670
ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs

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