HP3-TO3-CB CTS Thermal Management Products, HP3-TO3-CB Datasheet
HP3-TO3-CB
Specifications of HP3-TO3-CB
Related parts for HP3-TO3-CB
HP3-TO3-CB Summary of contents
Page 1
... METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP3 Series for Single TO-3 or Stud Mount • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 1.0 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Unplated Comm'l. Black Anodize HP3-000-U HP3-000-CB ...
Page 2
... HP3-T03-44CB HP3-436-U HP3-436-CB HP3-T015-U HP3-T015-CB HP3-T06-U HP3-T06-CB HP3-420-U HP3-420-CB HP3 for Dual TO-3 Outline • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 2.0 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Unplated Comm'l. Black ...
Page 3
... HP3 for Three TO-3 Outline • Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound. • Derate 3.0 °C/watt for unplated part in natural convection only. Ordering Information CTS IERC PART NO. Unplated Comm'l. Black Anodize HP3-T03-8U HP3-T03-8CB Semiconductor Accommodated Mil. Black Anodize HP3-T03-8B ...
Page 4
... Hole pattern no. 186 accommodates three TO-3s. Available in HP3 series heat dissipators only. HOLE PATTERNS 12. Hole pattern no. 437 accommodates two TO-3s (4-pin). Available in HP3 series heat dissipators only. 16. Hole pattern no. 1 accommodates T0-3s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. ...
Page 5
... T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other 1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators ...
Page 6
CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 04-13-04 ...