TXBF2-050-033U CTS Thermal Management Products, TXBF2-050-033U Datasheet

TXBF2-050-033U

Manufacturer Part Number

TXBF2-050-033U

Description

HEATSINK FAN TOP PRESSON T0-8

Manufacturer

CTS Thermal Management Products

Series

Fan Topr

Datasheet

1.TXP1808B.pdf (2 pages)

Specifications of TXBF2-050-033U

Package Cooled

TO-8

Attachment Method

Press Fit

Outline

31.75mm Dia

Height

0.33" (8.5mm)

Thermal Resistance @ Natural

41°C/W

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Power Dissipation @ Temperature Rise

Thermal Resistance @ Forced Air Flow

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CTS

iZIF

GENERAL DESCRIPTION

the PCB retainer for improved structural integrity and thermal

efficiency (.8°C-in./W). The iZIF

pending design for rugged military and aerospace circuit card

applications. It features a quarter-turn lock, uniform clamping

pressure, and can be sized to fit small daughter cards up to

9U VME. A bottom plate may also be added for additional

cooling and structural integrity. The iZIF

stainless steel socket head cap rod with beryllium copper

spring. A variety of finishes are available such as chemical

film, black anodize, and electroless nickel.

THERMAL LINKS

GENERAL DESCRIPTION

of the 6 to 8-segment fingers versus the 2 or 3-segment

fingers available from other manufacturers. These thermal

links are offered for TO-5s, TO-8s and TO-18s with or

without BeO washer and other appropriate hardware.

path between semiconductor and heat sinks or chassis.

FAN TOP SERIES

They provide an effective retainer and efficient thermal

CTS’s thermal links provide superior retention because

The iZIF

™

HEAT FRAME

™

is a custom aluminum heat frame that integrates

Fan Tops

*Natural convection, case-ambient mounted on G10 board

Dim.

“A”

.25

.36

.33

.12

1.25

Dim.

“B”

.50

.75

Semiconductor

Case Type

TO-18

TO-5

TO-8

TO-5

TO-8

™

is a highly reliable patent-

*Ø °C/W

150.0

81.1

57.7

41.0

56.6

™

features a 1/8”

TXBF2-032-036U TXBF2-032-036B

TXBF2-050-033U TXBF2-050-033B

TXBF-019-025U

TXCF-019-025U

TXBF-032-025U

TXCF-032-025U

TXCF-125-1U

TXCF-125-2U

Unplated

vibration and shock loads. The thermal links can be

inserted and removed multiple times without loss of

retention or damage to the finish over the entire JEDEC

case diameter range. They can be installed with a rivet or

eyelet, soldered to a PC pad or heat sink, mounted with a

single screw or with a threaded stud and hex nut.

Black Cadmium

Part Number

TXBF-019-025B

TXBF-032-025B

TXCF-125-1CB

TXCF-125-2B

There is excellent transistor retention under high

N.A.

TXCF-019-025CB

TXCF-032-025CB

Black Chem.

N.A.

BeCu Retainer

Brass Fan

Material

Brass

BeCu

Related parts for TXBF2-050-033U

TXBF2-050-033U Summary of contents

Page 1

... Part Number *Ø °C/W Unplated Black Cadmium 150.0 TXBF-019-025U TXBF-019-025B 150.0 TXCF-019-025U N.A. 81.1 TXBF-032-025U TXBF-032-025B 81.1 TXCF-032-025U N.A. 57.7 TXBF2-032-036U TXBF2-032-036B 41.0 TXBF2-050-033U TXBF2-050-033B 56.6 TXCF-125-1U TXCF-125-1CB 56.6 TXCF-125-2U TXCF-125- Black Chem. Material N.A. BeCu TXCF-019-025CB Brass N.A. BeCu TXCF-032-025CB Brass N ...

Page 2

THERMAL LINKS FOR TO-5, TO-8 AND TO-18 TRANSISTORS THERMAL LINKS FOR TO-8s TXBE-050-028 TXB2P-050-037 Dimensions are for reference use only. Contact CTS for dimensions with tolerances or standard part drawings. Thermal Link Retainers Without BeO Insulators Fig. Semiconductor # Case ...

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