658-60ABT2 Wakefield Thermal Solutions, 658-60ABT2 Datasheet - Page 14

• Manufacturer Part Number: 658-60ABT2
• Description: HEATSINK CPU 28MM SQ BLK W/TAPE
• Manufacturer: Wakefield Thermal Solutions
• Series: 658r

Specifications of 658-60ABT2

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Included)
• Outline: 27.94mm x 27.94mm
• Height: 0.600" (15.20mm)
• Power Dissipation @ Temperature Rise: 2.5W @ 30°C
• Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 27.9 mm L x 27.9 mm W x 15.24 mm H
• Designed For: BGA, Super BGA, PBGA, FPBGA, PowerPC
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1074

HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
100
100
100
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
100
100
200
200
200
200
200
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
500
500
500
500
500
600
600
600
600
600
700
700
700
700
700
14
12
10
1
0
8
6
4
2
0
100
100
7
6
5
4
3
2
1
0
10
7
6
5
4
3
2
1
0
6
100
5
4
3
2
1
9
8
0
7
6
5
4
3
2
1
0
100
100
100
8
7
6
5
4
3
2
8
7
6
5
4
3
2
100
100
200
200
200
200
200
200
200
200
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
300
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
604-40AB
604-60AB
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
300
614-100AB
614-50AB
614-100AP
614-50AB
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
610-35AB
610-40AB
400
400
400
400
400
400
400
400
614-30AB
614-30AB
500
500
(dashed)
(dashed)
500
500
500
500
500
500
600
600
600
600
600
600
600
600
700
700
700
700
700
700
700
700
5
4
3
2
1
0
100
8
7
6
5
4
3
2
8
7
6
5
4
3
2
100
100
200
20
20