SPK10-0.006-00-30 Bergquist, SPK10-0.006-00-30 Datasheet - Page 22
![THERMAL PAD TO-3 .006" K10](/photos/5/96/59602/k10-30_sml.jpg)
SPK10-0.006-00-30
Manufacturer Part Number
SPK10-0.006-00-30
Description
THERMAL PAD TO-3 .006" K10
Manufacturer
Bergquist
Series
Sil-Pad® K-10r
Specifications of SPK10-0.006-00-30
Usage
TO-3, TO-66
Shape
Rhombus
Outline
31.75mm x 17.78mm
Thickness
0.006" (0.152mm)
Backing, Carrier
Kapton®
Color
Beige
Thermal Resistivity
0.41°C/W
Thermal Conductivity
1.3 W/m-K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Adhesive
-
Other names
BER152
K10-30
K10-30
20
Solutions For Surface-Mount Applications
Thermal Clad
Intel Core
Phenom
Hi-Flow
The Hi-Flow family of phase change materials offers an easy-to-apply thermal interface
for many surface mount packages. At the phase change temperature, Hi-Flow materials
change from a solid and flow with minimal applied pressure.This characteristic optimizes
heat transfer by maximizing wet-out of the interface. Hi-Flow is commonly used to
replace messy thermal grease.
Bergquist phase change materials are specially compounded to prevent pump-out of
the interface area, which is often associated with thermal grease.Typical applications for
Hi-Flow materials include:
• Intel Core
• DC/DC converters
• Power modules
Hi-Flow materials are manufactured with or without film or foil carriers.
Custom shapes and sizes for non-standard applications are also available.
Sil-Pad
Sil-Pad is the benchmark in thermal interface materials. The Sil-Pad family of materials
are thermally conductive and electrically insulating. Available in custom shapes, sheets,
and rolls, Sil-Pad materials come in a variety of thicknesses and are frequently used in
SMT applications such as:
• Interface between thermal vias in a PCB, and a heat sink or casting
• Heat sink interface to many surface mount packages
Sil-Pad or
Bond-Ply
Power Device
Power Device
Processor
TM
TM
and Athlon
and Pentium
®
Mid Power Application with Bond-Ply or Sil-Pad
TM
®
Series, Pentium
®
are registered trademarks of Advanced Micro Devices, Inc.
®
are registered trademarks of Intel Corporation.
Hi-Flow without Thermal Clad
Hi-Flow with Thermal Clad
High Power Application
High Power Application
®
, Phenom
TM
, Athlon
®
, and other high performance CPUs
Hi-Flow
FR-4
Hi-Flow
Heat
Spreader
Heat
Spreader
FR-4 Board
Heat
Spreader