5595 210 MM X 300 MM 1.0 MM 3M, 5595 210 MM X 300 MM 1.0 MM Datasheet - Page 3
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5595 210 MM X 300 MM 1.0 MM
Manufacturer Part Number
5595 210 MM X 300 MM 1.0 MM
Description
THERM PAD 5595 210X300MM 1.0MM
Manufacturer
3M
Series
5595r
Datasheet
1.5595_210_MM_X_300_MM_1.0_MM.pdf
(4 pages)
Specifications of 5595 210 MM X 300 MM 1.0 MM
Usage
Sheet
Shape
Rectangular
Outline
210.00mm x 300.00mm
Thickness
0.040" (1.02mm)
Adhesive
Tacky - Both Sides
Color
Gray
Thermal Conductivity
1.6 W/m-K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Backing, Carrier
-
Thermal Resistivity
-
Other names
3M9605
WX300902250
WX300902250
3M
General Information
Product selection table for 3M™ Thermally Conductive Materials.
Application Ideas
• 3M™ Thermally Conductive Interface Thermal Pads are designed to provide a preferential heat-transfer path between
3M™ Thermally Conductive Tapes
3M™ Thermally Conductive Adhesives
3M™ Thermally Conductive Interface Pads
3M™ Thermally Conductive Interface Pads (silicone based)
3M™ Thermally Conductive Interface Pads (acrylic)
heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
™
TC-2707
TC-2810
Product
9889FR
5590H
5591S
5592S
5595S
8805
8810
8815
8820
5506
5509
5592
5595
Thermally Conductive Interface Pads 5595 and 5595S
Thickness
0.5 to 2.0
0.5 to 2.0
0.5 to 2.0
1.0 to 2.0
0.5 to 2.0
1.0 to 2.0
0.5 to 2.0
0.5 to 1.5
0.127
0.375
(mm)
0.25
0.50
1.0
—
—
Bulk Thermal
Conductivity
(W/m-K)
1.0 - 1.4
0.7
0.6
0.5
2.3
5.0
1.0
1.1
1.6
3.0
—
—
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
(3)
Typical Applications