HC1000-0.020-02-0404 Bergquist, HC1000-0.020-02-0404 Datasheet

HC1000-0.020-02-0404

Manufacturer Part Number

HC1000-0.020-02-0404

Description

THERMAL PAD 20MIL 4X4 GAPPAD

Manufacturer

Bergquist

Series

Gap Pad® HC1000r

Datasheets

1.803129.pdf (27 pages)

2.HC1000-0.020-02-0404.pdf (1 pages)

Specifications of HC1000-0.020-02-0404

Shape

Square

Outline

101.60mm x 101.60mm

Thickness

0.020" (0.508mm)

Adhesive

Tacky - Both Sides

Backing, Carrier

Fiberglass

Color

Gray

Thermal Conductivity

1.0 W/m-K

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Usage

Thermal Resistivity

Other names

GAPPADHC100020MIL
Q1144077

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Features and Benefits

• Thermal conductivity: 1.0 W/m-K

• Highly conformable, low hardness

• “Gel-like” modulus

• Fiberglass reinforced for puncture,

Gap Pad HC 1000 is an extremely conformable,

low-modulus polymer that acts as a thermal

interface and electrical insulator between

electronic components and heat sinks.The

“gel-like” modulus allows this material to fill

air gaps to enhance the thermal performance

of electronic systems. Gap Pad HC1000 is

offered with removable protective liners on

both sides of the material.

Note: Resultant thickness is defined as the final gap

thickness of the application.

The Bergquist Company -

North American Headquarters

18930 West 78th Street

Chanhassen, MN 55317

Phone: 800-347-4572

Fax: 952-835-0430

shear and tear resistance

0.25

Thickness vs. Thermal Resistance

0.30

Thermal Resistance (C-in

0.35

Gap Pad HC1000

The Bergquist Company -

European Headquarters

Bramenberg 9a, 3755 BT Eemnes

Netherlands

Phone: 31-35-5380684

Fax: 31-35-5380295

0.40

0.45

www.bergquistcompany.com

/W)

0.50

0.55

The Bergquist Company - Asia

Room 15, 8/F Wah Wai Industrial Centre

No. 38-40, Au Pui Wan Street

Fotan, Shatin, N.T. Hong Kong

Ph: 852.2690.9296

Fax: 852.2690.2344

Typical Applications Include:

• Computer and peripherals

• Telecommunications

• Heat interfaces to frames, chassis, or other heat spreading devices

• RDRAM™ memory modules / chip scale packages

• CDROM / DVD cooling

• Areas where irregular surfaces need to make a thermal interface to a heat sink

• DDR SDRAM memory modules

• FBDIMM modules

Configurations Available:

• Sheet form, die-cut parts, and roll form (converted or unconverted)

Building a Part Number

Note: To build a part number, visit our website at www.bergquistcompany.com.

PROPERTY

Color

Reinforcement Carrier

Thickness (inch) / (mm)

Inherent Surface Tack (1- or 2-sided)

Density (g/cc)

Heat Capacity (J/g-K)

Hardness, Bulk Rubber (Shore 00) (1)

Young’s Modulus (psi) / (kPa) (2)

Continuous Use Temp (°F) / (°C)

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

Dielectric Constant (1000 Hz)

Volume Resistivity (Ohm-meter)

Flame Rating

THERMAL

Thermal Conductivity (W/m-K)

1) Thirty second delay value Shore 00 hardness scale.

2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch

HC1000

information on Gap Pad modulus, refer to Bergquist Application Note #116.

–

0.015

TYPICAL PROPERTIES OF GAP PAD HC1000

–

All statements, technical information and recommendations herein are based on tests we believe to be reliable, and

THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED

WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to

replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product

for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR

MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,

INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR

THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not

contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.

–

0816

–

Gap Pad

IMPERIAL VALUE

“Gel-Like” Modulus Gap Filling Material

0.015 to 0.020

-76 to 392

Fiberglass

>5000

Gray

V-O

1.6

1.0

5.5

1.0

Standard Options

NA = Selected standard option. If not selecting a standard

option, insert company name, drawing number, and

revision level.

0816 = Standard sheet size 8" x 16", or

00 = custom configuration

02 = Natural tack, both sides

Standard thicknesses available: 0.015", 0.020"

HC1000 = High Compliance 1000 Material

METRIC VALUE

0.381 to 0.508

-60 to 200

Fiberglass

>5000

Gap Pad

Gray

275

V-O

1.6

1.0

5.5

1.0

and 0.020 inches thick. For more

HC1000

: U.S. Patent 5,679,457 and others

TEST METHOD

ASTM D2240

ASTM D5470

ASTM E1269

ASTM D374

ASTM D792

ASTM D575

ASTM D149

ASTM D150

ASTM D257

PDS_GP_HC1000_12.08

U.L. 94

Visual

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