LT1795ISW#TRM Linear Technology, LT1795ISW#TRM Datasheet - Page 11
![](/photos/31/30/313039/20pin_soic_w_sml.jpg)
LT1795ISW#TRM
Manufacturer Part Number
LT1795ISW#TRM
Description
Manufacturer
Linear Technology
Datasheet
1.LT1795ISWTRM.pdf
(12 pages)
Specifications of LT1795ISW#TRM
Power Supply Requirement
Dual
Package Type
SOIC W
Slew Rate
900V/us
Pin Count
20
Lead Free Status / RoHS Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTIO
6.60 0.10
(.0036 – .0079)
0.09 – 0.20
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 0.10
RECOMMENDED SOLDER PAD LAYOUT
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(.169 – .177)
4.30 – 4.50*
(.018 – .030)
0.45 – 0.75
SEE NOTE 4
(.195)
MILLIMETERS
4.95
U
(INCHES)
0.65 BSC
20-Lead Plastic TSSOP (4.4mm)
0.45 0.05
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CA
(.108)
2.74
1.05 0.10
0 – 8
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
FE Package
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.195)
4.95
14 13
12
11
FE20 (CA) TSSOP 0203
(.002 – .006)
0.05 – 0.15
(.108)
(.047)
2.74
1.20
MAX
6.40
BSC
LT1795
11
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