UJA1061TW/3V0,518 NXP Semiconductors, UJA1061TW/3V0,518 Datasheet - Page 69
UJA1061TW/3V0,518
Manufacturer Part Number
UJA1061TW/3V0,518
Description
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1061TW3V0518.pdf
(77 pages)
Specifications of UJA1061TW/3V0,518
Number Of Transceivers
1
Power Down Mode
Sleep/Standby
Operating Supply Voltage (min)
5.5V
Operating Temperature (max)
125C
Operating Temperature (min)
-40C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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12. Package outline
Fig 28. Package outline SOT549-1 (HTSSOP32)
UJA1061_6
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
0
Rev. 06 — 9 March 2010
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
Fault-tolerant CAN/LIN fail-safe system basis chip
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1061
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
69 of 77
A
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