TXC-06885BIOG Transwitch Corporation, TXC-06885BIOG Datasheet - Page 122

• Manufacturer Part Number: TXC-06885BIOG
• Manufacturer: Transwitch Corporation

Specifications of TXC-06885BIOG

• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Temperature Classification: Industrial
• Package Type: BGA
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

Envoy-CE4 Device
DATA SHEET
TXC-06885
The Envoy-CE4 device is packaged in a 27 mm × 27 mm, 580-Lead Plastic Ball Grid Array (PBGA) package
with a 1.0 mm pitch, as illustrated in
1 2 2 o f 1 2 8
A3
D D2
Notes:
1. All dimensions are in millimeters.
2. Identification of the solder ball A1
3. Size of array: 26 x 26, JEDEC code
A2
Values shown are for reference only.
corner is contained within this
shaded zone. This package corner
may be a 90° angle, or chamfered for
A1 identification.
MO-151.
E1/4
TRANSWITCH
TXC-06885BROG
TXC-06885BIOG
D1/4
E2
E
-
Note 2
Memory Maps and Bit Descriptions
Figure 25.
Figure 25. Envoy-CE4 Package Diagram
Dimension (Note 1)
A
0.50 R, 3 Places
-D1-
D1 (Nom)
A3 (Nom)
E1 (Nom)
A (Nom)
A1
b (Ref.)
e (Ref.)
P
A1
A2
D2
E2
D
E
AF
ACKAGE
AE
AD
AC
AB
AA Y W V
-
Bottom View
U
T
23.95
23.95
R P N M
1.12
-E1-
0.4
PRELIMINARY TXC-06885-MB, Ed. 6A
Nominal
L
I
K J H G F E D C B
2.23
0.56
0.63
27.0
25.0
27.0
25.0
1.0
NFORMATION
24.35
24.35
1.22
0.6
A
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
10
11
9
8
7
6
5
4
3
2
1
b
e
February 2005