PEB3322E-V14 Lantiq, PEB3322E-V14 Datasheet - Page 74

• Manufacturer Part Number: PEB3322E-V14
• Manufacturer: Lantiq

Specifications of PEB3322E-V14

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Figure 20
Note: The P-VQFN-48-4 package is only available with heatsink on bottom.
Attention: The exposed die pad and die pad edges are connected to VBATH
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Preliminary Product Overview
SMD = Surface Mounted Device
P-VQFN-48-4
(Plastic Very Thin Profile Quad Flat Non Leaded)
(VBATR) via the chip substrate. Due to the high voltage of up to 150 V
between VHR and VBATH (VBATR and BGND), touching of the die pad
or any attached conducting part can be hazardous. It must be
electrically insulated from other parts or board connections.
SLIC-S/-S2, SLIC-E/-E2, SLIC-P (PEB426x), SLIC-LCP (PEB 4262)
Top View
74
Rev. 2.0, 2004-05-11
Package Outlines
Dimensions in mm
gvq09350
VINETIC
®