TJA1020T/N1.118 NXP Semiconductors, TJA1020T/N1.118 Datasheet - Page 16

• Manufacturer Part Number: TJA1020T/N1.118
• Manufacturer: NXP Semiconductors

Specifications of TJA1020T/N1.118

• Number Of Transmitters: 1
• Power Supply Requirement: Single
• Package Type: SO
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temperature (max): 150C
• Operating Temperature (min): -40C
• Supply Current: 8mA
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Lead Free Status / RoHS Status: Compliant

Philips Semiconductors
BONDING PAD LOCATIONS
Table 2 Bonding pad locations (dimensions in m). All x and y co-ordinates are referenced to the bottom left hand
2004 Jan 13
handbook, full pagewidth
RXD
NSLP
NWAKE
TXD
GND1
GND2
GND3
LIN
BAT
INH
LIN transceiver
corner of the top aluminium layer.
SYMBOL
0
0
PAD
5A
5B
5C
1
2
1
2
3
4
6
7
8
Fig.10 Bonding pad locations.
4
3
y
16
x
8
5A 5B 5C
1075
1185
1295
1318
1235
1125
111
111
165
134
7
x
6
MGW322
CO-ORDINATES
Product specification
1570
1395
1133
1490
424
134
419
90
90
90
TJA1020
y