EXC-28BA221U Panasonic - ECG, EXC-28BA221U Datasheet - Page 4

• Manufacturer Part Number: EXC-28BA221U
• Description: BEAD CORE ARRAY 220OHM 100MA SMD
• Manufacturer: Panasonic - ECG
• Series: EXC28Br

Specifications of EXC-28BA221U

• Impedance @ Frequency: 220 Ohm @ 100MHz
• Current Rating: 100mA
• Dc Resistance (dcr): 700.0 mOhm Max
• Filter Type: Differential Mode - 4 Line Array
• Number Of Lines: 4
• Package / Case: 0804 (2010 Metric)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: EXC-28BA201U; EXC28BA201U; EXC28BA221U; P10754TR

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Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
● Never touch this product with the tip of a soldering iron.
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
3. Do not apply shock to Chip Bead Array (hereafter called the bead arrays) or pinch them with a hard tool (e.g. pliers
4. Store the bead arrays in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to
5. Use the bead arrays within half a year after the date of the out go ing inspection indicated on the packages.
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Recommended Land Pattern Design
Recommended Soldering Conditions
● Flow soldering
each electrode for 3 seconds or less.
Safety Precautions
in advance.
and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the bead arrays. Handle with care.
60 %, where there are no rapid changes in temperature or humidity.
● Recommended soldering conditions for refl ow
· We do not recommend fl ow soldering , because fl ow soldering may cause bridges between the electrodes.
· Refl ow soldering shall be performed a maximum of
· Please contact us for additional information when
· Please measure the temperature of the terminals
two times.
used in conditions other than those specifi ed.
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Preheating
E
F
Peak
Time
E
B
F
E
Heating
F
E
– 251 –
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Preheating
Main heating
Peak
Preheating
Main heating
Peak
140 °C to 160 °C
150 °C to 170 °C
Dimension (mm)
C
D
A
B
E
F
Above 200 °C
Above 230 °C
Temperature
Temperature
max. 260 °C
235 ± 10 °C
1.75
0.25
0.25
1.4
0.4
0.5
Chip Bead Array
60 s to 120 s
60 s to 120 s
30 s to 40 s
30 s to 40 s
max. 10 s
max. 10 s
Time
Time
00
Sep. 2010