BK1608HS102-T Taiyo Yuden, BK1608HS102-T Datasheet - Page 53

• Manufacturer Part Number: BK1608HS102-T
• Description: FERRITE BEAD 1000 OHM 0603
• Manufacturer: Taiyo Yuden
• Series: BKr

Specifications of BK1608HS102-T

• Impedance @ Frequency: 1K Ohm @ 100MHz
• Current Rating: 300mA
• Dc Resistance (dcr): 600.0 mOhm Max
• Filter Type: Differential Mode - Single
• Number Of Lines: 1
• Package / Case: 0603 (1608 Metric)
• Mounting Type: Surface Mount
• Impedance: 1kohm
• Ferrite Grade: HS
• Dc Resistance Max: 0.6ohm
• Dc Current Rating: 300mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603 / 1608
• Rohs Compliant: Yes
• Impedance Tolerance: ± 25%
• Features: HS
• Frequency: 100MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-1867-2; BK1608HS102-T

FBM Type
PRECAUTIONS
5.Handling
6.Storage conditions
Stages
Stages
・ Recommended conditions
Handling
1.Keep the inductors away from all magnets and magnetic
Setting PC boards
1.When setting a chip mounted base board, please make sure
Breakaway PC boards （splitting along perforations）
1.When splitting the PC board after mounting inductors, care
2.Board separation should not be done manually, but by using
Mechanical considerations
1.Please do not give the inductors any excessive mechanical
Storage
1.To maintain the solderability of terminal electrodes and to
Ambient temperature 0∼40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even
under ideal storage conditions, solderability of products
electrodes may decrease as time passes. For this reason,
inductors should be used within 6 months from the time of
delivery.
objects.
that there is no residual stress to the chip by distortion in
the board or at screw part.
should be taken not to give any stresses of deflection or
twisting to the board.
the appropriate devices.
shocks.
keep the packing material in good condition, temperature
and humidity in the storage area should be controlled..
Precautions
Precautions
1.There is a case that a characteristic varies with magnetic influence.
1.There is a case that a characteristic varies with residual stress.
1.Planning pattern configurations and the position of products should be carefully
1.There is a case to be damaged by a mechanical shock.
1. Under a high temperature and humidity environment, problems suchas reduced
performed to minimize stress.
solderability caused by oxidation of terminal electrodes and deterioration
oftaping/packaging materials may take place.
8
Technical considerations
Technical considerations
2/2
277
5