MCP14628-E/MF Microchip Technology, MCP14628-E/MF Datasheet - Page 8

• Manufacturer Part Number: MCP14628-E/MF
• Description: IC,Dual MOSFET Driver,LLCC,8PIN,PLASTIC
• Manufacturer: Microchip Technology
• Type: High Side/Low Sider

Specifications of MCP14628-E/MF

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Delay Time: 18ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 36V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-DFN
• Rise Time: 10 ns
• Fall Time: 10 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 0.08 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MCP14628
3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
The HIGHDR pin provides the gate drive signal to
control the high-side power MOSFET. The gate of the
high-side power MOSFET is connected to this pin.
3.2
The BOOT pin is the floating bootstrap supply pin for
the high-side gate drive. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side power MOS-
FET.
3.3
The control input signal is supplied to the PWM pin.
This tri-state pin controls the state of the HIGHDR and
LOWDR pins. Placing a voltage equal to V
pin causes both the HIGHDR and LOWDR to a low
state.
3.4
The GND pin provides ground for the MCP14628 cir-
cuitry. It should have a low impedance connection to
the bias supply source return. High peak currents will
flow out the GND pin when the low-side power
MOSFET is being turned off.
3.5
The LOWDR pin provides the gate drive signal to
control the low-side power MOSFET. The gate of the
low-side power MOSFET is connected to this pin.
DS22083A-page 8
SOIC
—
1
2
3
4
5
6
7
8
PIN DESCRIPTIONS
High-side Gate Driver Pin
(HIGHDR)
Floating Bootstrap Supply Pin
(BOOT)
PWM Input Control Pin (PWM)
Ground Pin (GND)
Low-side Gate Driver Pin
(LOWDR)
PIN FUNCTION TABLE .
3x3 DFN
PAD
1
2
3
4
5
6
7
8
HIGHDR
Symbol
LOWDR
PHASE
Table
BOOT
FCCM
PWM
GND
V
NC
CC
CC
/2 on this
3-1.
High-side Gate Driver Pin
Floating Bootstrap Supply Pin
PWM Input Control Pin
Ground
Low-side Gate Driver Pin
Supply Input Voltage
Forced Continuous Conduction Mode Pin
Switch Node Pin
Exposed Metal Pad
3.6
The V
capacitor is to be placed between this pin and the GND
pin. This capacitor should be placed as close to the
MCP14628 as possible.
3.7
The FCCM pin enables or disables the forced
continuous conduction mode. With the FCCM pin con-
nected to ground the MCP14628 enters a diode emula-
tion mode to improve system efficiency at light loads.
Continuous conduction is forced if the FCCM pin is
connected to V
3.8
The PHASE pin provides the return path for the high-
side gate driver. The source of the high-side power
MOSFET is connected to this pin.
3.9
The exposed metal pad of the DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board to aid in heat
removal from the package.
CC
Supply Input Voltage Pin (V
Forced Continuous Conduction
Mode Pin (FCCM)
Switch Node Pin (PHASE)
DFN Exposed Pad
pin provides bias to the MCP14628. A bypass
CC
Description
.
© 2008 Microchip Technology Inc.
CC
)