MCP1702-3602E/TO Microchip Technology, MCP1702-3602E/TO Datasheet - Page 5

Low Iq 250mA LDO, Vin 13.2V Max, Vout=3.6V 3 TO-92 BAG

MCP1702-3602E/TO

Manufacturer Part Number
MCP1702-3602E/TO
Description
Low Iq 250mA LDO, Vin 13.2V Max, Vout=3.6V 3 TO-92 BAG
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP1702-3602E/TO

Regulator Topology
Positive Fixed
Voltage - Output
3.6V
Voltage - Input
Up to 13.2V
Voltage - Dropout (typical)
0.525V @ 250mA
Number Of Regulators
1
Current - Output
250mA (Min)
Operating Temperature
-40°C ~ 125°C
Mounting Type
*
Package / Case
*
Input Voltage Max
13.2 V
Output Voltage
3.6 V
Dropout Voltage (max)
1100 mV
Output Current
250 mA
Load Regulation
1 %
Maximum Operating Temperature
+ 125 C
Mounting Style
TO-92
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Limit (min)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
TEMPERATURE SPECIFICATIONS
 2010 Microchip Technology Inc.
Temperature Ranges
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, 3L-SOT-23A
Thermal Resistance, 3L-SOT-89
Thermal Resistance, 3L-TO-92
Note 1:
2:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
Thermal Resistance values are subject to change. Please visit the Microchip web site for the latest packaging
information.
Parameters
(Note
2)
Sym
T
T
T
JA
JC
JA
JC
JA
JC
A
J
J
(Note
Min
-40
-65
1)
153.3
131.9
66.3
Typ
336
100
110
+125
+150
+150
Max
A
, T
J
, 
JA
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
). Exceeding the maximum allowable power
°C
°C
°C
Steady State
Transient
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
MCP1702
Conditions
DS22008E-page 5

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