MCP2022-330E/ST Microchip Technology, MCP2022-330E/ST Datasheet - Page 37
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MCP2022-330E/ST
Manufacturer Part Number
MCP2022-330E/ST
Description
IC,Automotive,LIN Transceiver,TSSOP,14PIN,PLASTIC
Manufacturer
Microchip Technology
Type
Transceiverr
Datasheet
1.MCP2021-330ESN.pdf
(46 pages)
Specifications of MCP2022-330E/ST
Number Of Drivers/receivers
1/1
Protocol
LIN
Voltage - Supply
6 V ~ 18 V
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP2022-330E/ST
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2009 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
D
N
A
E
α
e
h
L
φ
c
b
β
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
φ
0°
5°
5°
–
L
MILLIMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
MCP2021/2
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS22018E-page 37
α
c