PIC12F675-E/MD Microchip Technology, PIC12F675-E/MD Datasheet - Page 127

• Manufacturer Part Number: PIC12F675-E/MD
• Description: 1.75KB Flash, 64 RAM, 6 I/O 8 DFN 4x4mm TUBE
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F675-E/MD

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Size: 1.75KB (1K x 14)
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DFN
• Processor Series: PIC12F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Interface Type: RS- 232, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 6
• Number Of Timers: 2
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53270-913
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164326 - MODULA SKT PM3 20QFN
• Connectivity: -
• Lead Free Status / Rohs Status: Details

APPENDIX A:
Revision A
This is a new data sheet.
Revision B
Added characterization graphs.
Updated specifications.
Added notes to indicate Microchip programmers
maintain all Calibration bits to factory settings and the
PIC12F675 ANSEL register must be initialized to
configure pins as digital I/O.
Updated MLF-S package name to DFN-S.
Revision C
Revision D (01/2007)
Updated Package Drawings; Replace PICmicro with
PIC; Revised Product ID example (b).
Revision E (03/2007)
Replaced Package Drawings (Rev. AM); Replaced
Development Support Section.
Revision F (09/2009)
Updated Registers to new format; Added information to
the “Package Marking Information” (8-Lead DFN) and
“Package Details” sections (8-Lead Dual Flat, No Lead
Package (MD) 4X4X0.9 mm Body (DFN)); Added Land
Patterns for SOIC (SN) and DFN-S (MF) packages;
Updated Register 3-2; Added MD Package to the
Product identification System chapter; Other minor
corrections.
Revision G (03/2010)
Updated the Instruction Set Summary section, adding
pages 76 and 77.
 2010 Microchip Technology Inc.
DATA SHEET
REVISION HISTORY
APPENDIX B:
The differences between the PIC12F629/675 devices
listed in this data sheet are shown in Table B-1.
TABLE B-1:
Feature
A/D
PIC12F629/675
DEVICE DIFFERENCES
DEVICE
DIFFERENCES
PIC12F629
No
DS41190G-page 127
PIC12F675
Yes