PIC12HV609-E/MD Microchip Technology, PIC12HV609-E/MD Datasheet - Page 3
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PIC12HV609-E/MD
Manufacturer Part Number
PIC12HV609-E/MD
Description
1.75KB Flash, 64B RAM, 6 I/O, 8MHz Internal Oscillator 8 DFN 4x4mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(8 pages)
3.PIC12F609T-ISN.pdf
(26 pages)
4.PIC16F616T-ISL.pdf
(8 pages)
Specifications of PIC12HV609-E/MD
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DFN
Processor Series
PIC12H
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232 , USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
2
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164326 - MODULA SKT PM3 20QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
© 2007 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
PIC12F609/615/12HV609/615
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
D
A
E
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS80294B-page 3
φ